D. R. Frear
Impact in
- General Materials Science top 0.1%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 0.5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 78
- 3D IC and TSV technologies 39
-
- Advanced Welding Techniques Analysis 22
- Intermetallics and Advanced Alloy Properties 15
- Aluminum Alloys Composites Properties 8
- Co-authors
- Paul T. Vianco (5 shared papers)Jihun Jang (8 shared papers)T. Y. Lee (4 shared papers)J. W. Morris (11 shared papers)D. Grivas (11 shared papers)K. N. Tu (6 shared papers)J. K. Lin (7 shared papers)K. N. Tu (4 shared papers)
- Journals
- Journal of Electronic Materials (16 papers)Journal of Applied Physics (10 papers)JOM (7 papers)Metallurgical Transactions A (4 papers)Journal of materials research/Pratt's guide to venture capital sources (4 papers)
- Partner nations
- United StatesItalySingapore
In The Last Decade
D. R. Frear
91 papers receiving 4.1k citations
Peers
Comparison fields: 5 of 65
- General Materials Science 329
- Mechanical Engineering 2.7k
- Electrical and Electronic Engineering 3.9k
- Electronic, Optical and Magnetic Materials 537
- Aerospace Engineering 594
Countries citing papers authored by D. R. Frear
This map shows the geographic impact of D. R. Frear's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. R. Frear with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. R. Frear more than expected).
Fields of papers citing papers by D. R. Frear
This network shows the impact of papers produced by D. R. Frear. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. R. Frear. The network helps show where D. R. Frear may publish in the future.
Co-authors
The 25 scholars most cited alongside D. R. Frear, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 96 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | The Mechanics of solder alloy interconnects | 1993 | 274 |
| 2 | 2001 | 272 | |
| 3 | 1999 | 252 | |
| 4 | 1994 | 244 | |
| 5 | 2002 | 227 | |
| 6 | 2001 | 199 | |
| 7 | 2000 | 173 | |
| 8 | Solder mechanics : a state of the art assessment | 1991 | 172 |
| 9 | 1993 | 165 | |
| 10 | 2001 | 151 | |
| 11 | 1988 | 113 | |
| 12 | 1993 | 108 | |
| 13 | 2001 | 107 | |
| 14 | 2000 | 99 | |
| 15 | 1987 | 82 | |
| 16 | 2003 | 80 | |
| 17 | 2008 | 74 | |
| 18 | 1996 | 70 | |
| 19 | 1987 | 68 | |
| 20 | 2008 | 64 |
About D. R. Frear
D. R. Frear is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics, having authored 96 papers that have together received 4.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (78 papers), 3D IC and TSV technologies (39 papers), Advanced Welding Techniques Analysis (22 papers), Intermetallics and Advanced Alloy Properties (15 papers), Copper Interconnects and Reliability (15 papers), Semiconductor materials and interfaces (8 papers), Aluminum Alloys Composites Properties (8 papers) and Aluminum Alloy Microstructure Properties (7 papers). The work is most often cited by research in General Materials Science (329 citations), Mechanical Engineering (2.7k citations), Electrical and Electronic Engineering (3.9k citations), Electronic, Optical and Magnetic Materials (537 citations) and Aerospace Engineering (594 citations). D. R. Frear has collaborated with scholars based in United States, Italy and Singapore. Frequent co-authors include Paul T. Vianco, Jihun Jang, T. Y. Lee, J. W. Morris, D. Grivas, K. N. Tu, J. K. Lin, K. N. Tu, S.-M. Kuo and W.B. Jones. Their work appears in journals such as Journal of Electronic Materials, Journal of Applied Physics, JOM, Metallurgical Transactions A and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.