H. Balkan
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 9
- Integrated Circuits and Semiconductor Failure Analysis 2
- Electromagnetic Compatibility and Noise Suppression 2
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- Advanced Welding Techniques Analysis 2
- Electrical Contact Performance and Analysis 2
- Co-authors
- P. Elenius (5 shared papers)Woon‐Seop Choi (2 shared papers)Everett C. C. Yeh (2 shared papers)K. N. Tu (1 shared paper)Henry Y. Lu (4 shared papers)K. Y. Simon Ng (3 shared papers)K. N. Tu (2 shared papers)Ke Zeng (1 shared paper)
- Journals
- IEEE Transactions on Device and Materials Reliability (1 paper)Microelectronics Reliability (1 paper)Applied Physics Letters (1 paper)JOM (1 paper)International Journal of Solids and Structures (1 paper)
- Partner nations
- United StatesItalySingapore
In The Last Decade
H. Balkan
13 papers receiving 523 citations
Peers
Comparison fields: 5 of 27
- Electronic, Optical and Magnetic Materials 205
- Electrical and Electronic Engineering 528
- General Materials Science 20
- Mechanical Engineering 230
- Aerospace Engineering 35
Countries citing papers authored by H. Balkan
This map shows the geographic impact of H. Balkan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Balkan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Balkan more than expected).
Fields of papers citing papers by H. Balkan
This network shows the impact of papers produced by H. Balkan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Balkan. The network helps show where H. Balkan may publish in the future.
Co-authors
The 23 scholars most cited alongside H. Balkan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 301 | |
| 2 | 2002 | 78 | |
| 3 | 2006 | 42 | |
| 4 | 2003 | 35 | |
| 5 | 2013 | 23 | |
| 6 | 2005 | 16 | |
| 7 | 2005 | 14 | |
| 8 | 2003 | 13 | |
| 9 | 2014 | 11 | |
| 10 | 2004 | 5 | |
| 11 | 1998 | 4 | |
| 12 | 1995 | 4 | |
| 13 | Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading. | 1996 | 1 |
| 14 | 2005 | 1 | |
| 15 | 2002 | 0 |
About H. Balkan
H. Balkan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering and Civil and Structural Engineering, having authored 15 papers that have together received 548 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers), Copper Interconnects and Reliability (3 papers), Advanced Welding Techniques Analysis (2 papers), Electrical Contact Performance and Analysis (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Electromagnetic Compatibility and Noise Suppression (2 papers) and Numerical methods in engineering (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (205 citations), Electrical and Electronic Engineering (528 citations), General Materials Science (20 citations), Mechanical Engineering (230 citations) and Aerospace Engineering (35 citations). H. Balkan has collaborated with scholars based in United States, Italy and Singapore. Frequent co-authors include P. Elenius, Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu, Henry Y. Lu, K. Y. Simon Ng, K. N. Tu, Ke Zeng, M. Li and Rahul Panat. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Microelectronics Reliability, Applied Physics Letters, JOM and International Journal of Solids and Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.