Jong‐Kai Lin
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
-
- Copper Interconnects and Reliability
Papers in
-
- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 5
- Electrodeposition and Electroless Coatings 1
-
- Metal and Thin Film Mechanics 1
- Co-authors
- Jin‐Wook Jang (9 shared papers)D. R. Frear (9 shared papers)Xiaowu Zhang (5 shared papers)Fa Xing (2 shared papers)Li Li (3 shared papers)Yifan Guo (3 shared papers)Yang Rao (1 shared paper)Sean Michael Hayes (1 shared paper)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (3 papers)Journal of Applied Physics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)The Journal of Adhesion (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)
- Partner nations
- United StatesSingaporeGermany
In The Last Decade
Jong‐Kai Lin
32 papers receiving 394 citations
Peers
Comparison fields: 5 of 17
- Electrical and Electronic Engineering 401
- Electronic, Optical and Magnetic Materials 8
- General Materials Science 1
- Mechanics of Materials 6
- Mechanical Engineering 8
Countries citing papers authored by Jong‐Kai Lin
This map shows the geographic impact of Jong‐Kai Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong‐Kai Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong‐Kai Lin more than expected).
Fields of papers citing papers by Jong‐Kai Lin
This network shows the impact of papers produced by Jong‐Kai Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong‐Kai Lin. The network helps show where Jong‐Kai Lin may publish in the future.
Co-authors
The 25 scholars most cited alongside Jong‐Kai Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 56 | |
| 2 | 2002 | 45 | |
| 3 | 2002 | 37 | |
| 4 | 2016 | 35 | |
| 5 | 2007 | 26 | |
| 6 | 2004 | 20 | |
| 7 | 2015 | 20 | |
| 8 | 2002 | 19 | |
| 9 | 2002 | 18 | |
| 10 | 2002 | 14 | |
| 11 | 2011 | 14 | |
| 12 | 2014 | 12 | |
| 13 | 2016 | 12 | |
| 14 | 2015 | 10 | |
| 15 | 2004 | 8 | |
| 16 | 2015 | 8 | |
| 17 | 2004 | 7 | |
| 18 | 2004 | 6 | |
| 19 | 2014 | 6 | |
| 20 | 2016 | 6 |
About Jong‐Kai Lin
Jong‐Kai Lin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Nuclear Energy and Engineering, Waste Management and Disposal and Infectious Diseases, having authored 33 papers that have together received 415 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (5 papers), Metal and Thin Film Mechanics (1 paper) and Electrodeposition and Electroless Coatings (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (401 citations), Electronic, Optical and Magnetic Materials (8 citations), General Materials Science (1 citation), Mechanics of Materials (6 citations) and Mechanical Engineering (8 citations). Jong‐Kai Lin has collaborated with scholars based in United States, Singapore and Germany. Frequent co-authors include Jin‐Wook Jang, D. R. Frear, Xiaowu Zhang, Fa Xing, Li Li, Yifan Guo, Yang Rao, Sean Michael Hayes, F. X. Che and Ravi Prakash Sharma. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Journal of Applied Physics, IEEE Transactions on Components Packaging and Manufacturing Technology, The Journal of Adhesion and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.