Iris Xu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Photolithography Techniques
- VLSI and FPGA Design Techniques
Papers in
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- Electronic Packaging and Soldering Technologies 3
- 3D IC and TSV technologies 3
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- Copper Interconnects and Reliability 2
- Co-authors
- Nelson Fan (3 shared papers)K. H. Tan (3 shared papers)Ming Li (2 shared papers)Rozalia Beica (3 shared papers)Sze Pei Lim (3 shared papers)Kai Wu (2 shared papers)Xi Cao (3 shared papers)John H. Lau (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IMAPSource Proceedings (1 paper)
- Partner nations
- ChinaUnited StatesIndia
In The Last Decade
Iris Xu
3 papers receiving 42 citations
Peers
Comparison fields: 5 of 17
- Electrical and Electronic Engineering 52
- Industrial and Manufacturing Engineering 4
- Electronic, Optical and Magnetic Materials 6
- Biomedical Engineering 12
- Automotive Engineering 3
Countries citing papers authored by Iris Xu
This map shows the geographic impact of Iris Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Iris Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Iris Xu more than expected).
Fields of papers citing papers by Iris Xu
This network shows the impact of papers produced by Iris Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Iris Xu. The network helps show where Iris Xu may publish in the future.
Co-authors
The 19 scholars most cited alongside Iris Xu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 40 | |
| 2 | 2017 | 10 | |
| 3 | 2018 | 4 |
About Iris Xu
Iris Xu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Infectious Diseases and Organic Chemistry, having authored 3 papers that have together received 54 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers), Copper Interconnects and Reliability (2 papers) and Nanofabrication and Lithography Techniques (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (52 citations), Industrial and Manufacturing Engineering (4 citations), Electronic, Optical and Magnetic Materials (6 citations), Biomedical Engineering (12 citations) and Automotive Engineering (3 citations). Iris Xu has collaborated with scholars based in China, United States and India. Frequent co-authors include Nelson Fan, K. H. Tan, Ming Li, Rozalia Beica, Sze Pei Lim, Kai Wu, Xi Cao, John H. Lau, Eric Kuah and Margie Li. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.