Cemal Basaran
Impact in
- Mechanics of Materials top 0.5%
- Fatigue and fracture mechanics
- Mechanical Engineering top 1%
- High Temperature Alloys and Creep
Papers in
-
- Electronic Packaging and Soldering Technologies 98
- 3D IC and TSV technologies 22
-
- Metal and Thin Film Mechanics 22
- Mechanical Behavior of Composites 21
- Co-authors
- Tarek Ragab (31 shared papers)Douglas C. Hopkins (21 shared papers)Shihua Nie (11 shared papers)Minghui Lin (14 shared papers)Hua Ye (6 shared papers)Hua Ye (7 shared papers)Wei Yao (9 shared papers)Shidong Li (14 shared papers)
- Journals
- Journal of Electronic Packaging (18 papers)International Journal of Damage Mechanics (13 papers)Mechanics of Materials (13 papers)International Journal of Solids and Structures (13 papers)Computational Materials Science (12 papers)
- Partner nations
- United StatesEgyptSaudi Arabia
In The Last Decade
Cemal Basaran
187 papers receiving 4.6k citations
Peers
Comparison fields: 5 of 88
- Mechanics of Materials 1.8k
- Mechanical Engineering 1.6k
- Metals and Alloys 110
- Electronic, Optical and Magnetic Materials 756
- Electrical and Electronic Engineering 2.4k
Countries citing papers authored by Cemal Basaran
This map shows the geographic impact of Cemal Basaran's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cemal Basaran with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cemal Basaran more than expected).
Fields of papers citing papers by Cemal Basaran
This network shows the impact of papers produced by Cemal Basaran. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cemal Basaran. The network helps show where Cemal Basaran may publish in the future.
Co-authors
The 25 scholars most cited alongside Cemal Basaran, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 192 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 207 | |
| 2 | 1998 | 200 | |
| 3 | 2004 | 196 | |
| 4 | 2002 | 131 | |
| 5 | 2003 | 102 | |
| 6 | 2004 | 101 | |
| 7 | 2005 | 83 | |
| 8 | 2013 | 79 | |
| 9 | 2000 | 75 | |
| 10 | 2007 | 74 | |
| 11 | 2009 | 69 | |
| 12 | 2003 | 65 | |
| 13 | 2002 | 62 | |
| 14 | 2013 | 60 | |
| 15 | 2006 | 57 | |
| 16 | 2003 | 56 | |
| 17 | 2005 | 55 | |
| 18 | 2004 | 52 | |
| 19 | 1998 | 51 | |
| 20 | 2003 | 51 |
About Cemal Basaran
Cemal Basaran is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 192 papers that have together received 4.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (98 papers), Copper Interconnects and Reliability (32 papers), Microstructure and mechanical properties (30 papers), Graphene research and applications (24 papers), 3D IC and TSV technologies (22 papers), Metal and Thin Film Mechanics (22 papers), Carbon Nanotubes in Composites (21 papers) and Mechanical Behavior of Composites (21 papers). The work is most often cited by research in Mechanics of Materials (1.8k citations), Mechanical Engineering (1.6k citations), Metals and Alloys (110 citations), Electronic, Optical and Magnetic Materials (756 citations) and Electrical and Electronic Engineering (2.4k citations). Cemal Basaran has collaborated with scholars based in United States, Egypt and Saudi Arabia. Frequent co-authors include Tarek Ragab, Douglas C. Hopkins, Shihua Nie, Minghui Lin, Hua Ye, Hua Ye, Wei Yao, Shidong Li, Alexander N. Cartwright and Juan Gómez. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Damage Mechanics, Mechanics of Materials, International Journal of Solids and Structures and Computational Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.