F. X. Che
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Electrodeposition and Electroless Coatings
- Semiconductor materials and devices
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 11
- Electronic Packaging and Soldering Technologies 8
- Silicon Carbide Semiconductor Technologies 1
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- Heat Transfer and Optimization 1
- Co-authors
- Xiaowu Zhang (11 shared papers)Chee Lip Gan (2 shared papers)Wahyuaji Narottama Putra (2 shared papers)Shan Gao (3 shared papers)Alastair David Trigg (2 shared papers)K. L. Pey (1 shared paper)Riko I Made (1 shared paper)Xiao Fang Ang (1 shared paper)
- Journals
- Journal of Electronic Materials (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)Microelectronics Reliability (1 paper)IEEE Electronics Packaging Technology Conference (EPTC) (6 papers)
In The Last Decade
F. X. Che
16 papers receiving 367 citations
Peers
Comparison fields: 5 of 15
- Electrical and Electronic Engineering 381
- Electronic, Optical and Magnetic Materials 4
- Ceramics and Composites 1
- Mechanical Engineering 6
- Biophysics 1
Countries citing papers authored by F. X. Che
This map shows the geographic impact of F. X. Che's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. X. Che with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. X. Che more than expected).
Fields of papers citing papers by F. X. Che
This network shows the impact of papers produced by F. X. Che. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. X. Che. The network helps show where F. X. Che may publish in the future.
Co-authors
The 25 scholars most cited alongside F. X. Che, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 146 | |
| 2 | 2013 | 80 | |
| 3 | 2011 | 24 | |
| 4 | 2011 | 22 | |
| 5 | 2010 | 18 | |
| 6 | 2012 | 17 | |
| 7 | 2011 | 14 | |
| 8 | 2014 | 14 | |
| 9 | 2014 | 12 | |
| 10 | 2011 | 10 | |
| 11 | 2011 | 8 | |
| 12 | 2014 | 8 | |
| 13 | 2014 | 6 | |
| 14 | 2011 | 4 | |
| 15 | 2013 | 4 | |
| 16 | 2012 | 2 | |
| 17 | 2014 | 0 |
About F. X. Che
F. X. Che is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Nuclear Energy and Engineering, Waste Management and Disposal and Infectious Diseases, having authored 17 papers that have together received 389 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (8 papers), Silicon Carbide Semiconductor Technologies (1 paper) and Heat Transfer and Optimization (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (381 citations), Electronic, Optical and Magnetic Materials (4 citations), Ceramics and Composites (1 citation), Mechanical Engineering (6 citations) and Biophysics (1 citation). F. X. Che has collaborated with scholars based in Singapore, Germany and Taiwan. Frequent co-authors include Xiaowu Zhang, Chee Lip Gan, Wahyuaji Narottama Putra, Shan Gao, Alastair David Trigg, K. L. Pey, Riko I Made, Xiao Fang Ang, T.C. Chai and Jun Wei. Their work appears in journals such as Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Microelectronics Reliability and IEEE Electronics Packaging Technology Conference (EPTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.