Douglas Yu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- VLSI and FPGA Design Techniques
- Hardware and Architecture top 5%
Papers in
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- 3D IC and TSV technologies 40
- Semiconductor materials and devices 20
- Electronic Packaging and Soldering Technologies 16
- Photonic and Optical Devices 6
- Semiconductor Lasers and Optical Devices 6
- Integrated Circuits and Semiconductor Failure Analysis 6
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- Copper Interconnects and Reliability 11
- Co-authors
- Chuei-Tang Wang (12 shared papers)W.C. Chiou (8 shared papers)C. T. Wang (10 shared papers)Chung-Hao Tsai (12 shared papers)K. C. Ting (5 shared papers)S. Y. Hou (6 shared papers)Christine Chiu (2 shared papers)Cheng‐Hsien Wu (2 shared papers)
- Journals
- IEEE Transactions on Electron Devices (3 papers)2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (1 paper)Symposium on VLSI Technology (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)2021 IEEE International Electron Devices Meeting (IEDM) (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Douglas Yu
54 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 1.3k
- Hardware and Architecture 127
- Electronic, Optical and Magnetic Materials 173
- Automotive Engineering 108
- Biomedical Engineering 164
Countries citing papers authored by Douglas Yu
This map shows the geographic impact of Douglas Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Douglas Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Douglas Yu more than expected).
Fields of papers citing papers by Douglas Yu
This network shows the impact of papers produced by Douglas Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Douglas Yu. The network helps show where Douglas Yu may publish in the future.
Co-authors
The 25 scholars most cited alongside Douglas Yu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 59 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 210 | |
| 2 | 2017 | 168 | |
| 3 | 2012 | 106 | |
| 4 | 2021 | 64 | |
| 5 | 2020 | 56 | |
| 6 | 2015 | 49 | |
| 7 | 2018 | 47 | |
| 8 | 2020 | 43 | |
| 9 | 2019 | 38 | |
| 10 | 2020 | 35 | |
| 11 | 2020 | 30 | |
| 12 | 2018 | 30 | |
| 13 | 2016 | 29 | |
| 14 | 2021 | 28 | |
| 15 | 2016 | 28 | |
| 16 | 2014 | 28 | |
| 17 | 2021 | 23 | |
| 18 | 2021 | 22 | |
| 19 | 2020 | 22 | |
| 20 | 2019 | 21 |
About Douglas Yu
Douglas Yu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Hardware and Architecture, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 59 papers that have together received 1.4k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (40 papers), Semiconductor materials and devices (20 papers), Electronic Packaging and Soldering Technologies (16 papers), Copper Interconnects and Reliability (11 papers), Photonic and Optical Devices (6 papers), Semiconductor Lasers and Optical Devices (6 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and VLSI and Analog Circuit Testing (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Hardware and Architecture (127 citations), Electronic, Optical and Magnetic Materials (173 citations), Automotive Engineering (108 citations) and Biomedical Engineering (164 citations). Douglas Yu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Chuei-Tang Wang, W.C. Chiou, C. T. Wang, Chung-Hao Tsai, K. C. Ting, S. Y. Hou, Christine Chiu, Cheng‐Hsien Wu, Cheng‐Chieh Hsieh and Chung-Hsien Tsai. Their work appears in journals such as IEEE Transactions on Electron Devices, 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Symposium on VLSI Technology, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and 2021 IEEE International Electron Devices Meeting (IEDM).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.