IEEE Transactions on Advanced Packaging
About
The 1.0k papers published in IEEE Transactions on Advanced Packaging in the last decades have received a total of 17.6k indexed citations.
Papers published in IEEE Transactions on Advanced Packaging usually cover Electrical and Electronic Engineering (920 papers), Mechanical Engineering (114 papers) and Mechanics of Materials (107 papers) specifically the topics of 3D IC and TSV technologies (341 papers), Electromagnetic Compatibility and Noise Suppression (334 papers) and Electronic Packaging and Soldering Technologies (311 papers). The most active scholars publishing in IEEE Transactions on Advanced Packaging are R. Boudreau, Madhavan Swaminathan, M. Nakhla, S. Grivet‐Talocia, C.P. Wong, Rao Tummala, Gerhard Tröster, Ramachandra Achar, István Novák and Bjørn Gustavsen.
In The Last Decade
Fields of papers published in IEEE Transactions on Advanced Packaging
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers published in IEEE Transactions on Advanced Packaging. Nodes represent fields, and links connect fields that are likely to share authors.
Countries where authors publish in IEEE Transactions on Advanced Packaging
Since SpecializationTotal citations of papers
This map shows the geographic distribution of research published in IEEE Transactions on Advanced Packaging. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in IEEE Transactions on Advanced Packaging with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).
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