IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
- Electrostatic Discharge in Electronics
- Semiconductor Lasers and Optical Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Microwave Engineering and Waveguides
- Hardware and Architecture top 10%
Papers in
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- Electronic Packaging and Soldering Technologies 151
- 3D IC and TSV technologies 140
- Electromagnetic Compatibility and Noise Suppression 106
- Semiconductor Lasers and Optical Devices 59
- Low-power high-performance VLSI design 40
- Electrostatic Discharge in Electronics 39
- Photonic and Optical Devices 34
- VLSI and FPGA Design Techniques 27
In The Last Decade
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
381 papers receiving 6.6k citations
Peers
Comparison fields: 5 of 90
- Electrical and Electronic Engineering 6.2k
- Hardware and Architecture 460
- Mechanics of Materials 875
- Mechanical Engineering 1.3k
- General Materials Science 82
Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology Part B
This map shows the geographic impact of research published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components Packaging and Manufacturing Technology Part B more than expected).
Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B
This network shows the impact of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B.
About IEEE Transactions on Components Packaging and Manufacturing Technology Part B
The 386 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B in the last decades have received a total of 7.2k indexed citations . Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B usually cover Electrical and Electronic Engineering (357 papers), Hardware and Architecture (35 papers), Mechanics of Materials (44 papers), General Materials Science (5 papers) and Mechanical Engineering (47 papers) specifically the topics of Electronic Packaging and Soldering Technologies (151 papers), 3D IC and TSV technologies (140 papers), Electromagnetic Compatibility and Noise Suppression (106 papers), Semiconductor Lasers and Optical Devices (59 papers), Low-power high-performance VLSI design (40 papers), Electrostatic Discharge in Electronics (39 papers), Photonic and Optical Devices (34 papers) and VLSI and FPGA Design Techniques (27 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part B are Paul D. Franzon, John H. Lau, Johan Liu, Derek Abbott, Said F. Al-Sarawi, K.K. Wang, J.K.L. Lai, A. Mertol, Y.C. Chan and Zonghe Lai.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.