Michael Ellsworth
Impact in
- Language and Linguistics top 2%
- Syntax, Semantics, Linguistic Variation
- linguistics and terminology studies
- Lexicography and Language Studies
- Artificial Intelligence top 2%
- Natural Language Processing Techniques
- Topic Modeling
- Semantic Web and Ontologies
Papers in
-
- Heat Transfer and Optimization 22
- Refrigeration and Air Conditioning Technologies 4
-
- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 5
- Co-authors
- Jan Scheffczyk (3 shared papers)Josef Ruppenhofer (3 shared papers)Christopher R. Johnson (2 shared papers)Miriam R. L. Petruck (7 shared papers)Robert E. Simons (7 shared papers)Richard C. Chu (6 shared papers)Collin F. Baker (9 shared papers)Roger Schmidt (5 shared papers)
- Journals
- Journal of Electronic Packaging (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)Zeitschrift für Literaturwissenschaft und Linguistik (1 paper)Journal of Medical Internet Research (1 paper)Journal of Heat Transfer (1 paper)
- Partner nations
- United StatesGermanySpain
In The Last Decade
Michael Ellsworth
50 papers receiving 1.4k citations
Michael Ellsworth's Hit Papers
Peers
Comparison fields: 5 of 92
- Language and Linguistics 341
- Artificial Intelligence 801
- Mechanical Engineering 384
- Experimental and Cognitive Psychology 119
- Hardware and Architecture 64
Countries citing papers authored by Michael Ellsworth
This map shows the geographic impact of Michael Ellsworth's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Ellsworth with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Ellsworth more than expected).
Fields of papers citing papers by Michael Ellsworth
This network shows the impact of papers produced by Michael Ellsworth. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Ellsworth. The network helps show where Michael Ellsworth may publish in the future.
Co-authors
The 25 scholars most cited alongside Michael Ellsworth, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 54 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | FrameNet II: Extended theory and practice Hit paper breakdown → | 2006 | 635 |
| 2 | 2004 | 196 | |
| 3 | FrameNet: Theory and Practice | 2003 | 131 |
| 4 | 2007 | 84 | |
| 5 | 2005 | 63 | |
| 6 | 2012 | 53 | |
| 7 | 2008 | 51 | |
| 8 | BioFrameNet: A Domain-Specific FrameNet Extension with Links to Biomedical Ontologies. | 2006 | 48 |
| 9 | 2009 | 39 | |
| 10 | Linking FrameNet to the Suggested Upper Merged Ontology | 2006 | 37 |
| 11 | 2010 | 23 | |
| 12 | 2004 | 23 | |
| 13 | 2019 | 16 | |
| 14 | 2007 | 16 | |
| 15 | Reframing FrameNet Data | 2004 | 14 |
| 16 | 2003 | 13 | |
| 17 | 2011 | 13 | |
| 18 | 2013 | 11 | |
| 19 | 2009 | 11 | |
| 20 | 2012 | 10 |
About Michael Ellsworth
Michael Ellsworth is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Artificial Intelligence, Hardware and Architecture and Computer Networks and Communications, having authored 54 papers that have together received 1.6k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (22 papers), Natural Language Processing Techniques (15 papers), Topic Modeling (12 papers), Semantic Web and Ontologies (8 papers), Parallel Computing and Optimization Techniques (7 papers), 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Refrigeration and Air Conditioning Technologies (4 papers). The work is most often cited by research in Language and Linguistics (341 citations), Artificial Intelligence (801 citations), Mechanical Engineering (384 citations), Experimental and Cognitive Psychology (119 citations) and Hardware and Architecture (64 citations). Michael Ellsworth has collaborated with scholars based in United States, Germany and Spain. Frequent co-authors include Jan Scheffczyk, Josef Ruppenhofer, Christopher R. Johnson, Miriam R. L. Petruck, Robert E. Simons, Richard C. Chu, Collin F. Baker, Roger Schmidt, Katrin Erk and Charles J. Fillmore. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Device and Materials Reliability, Zeitschrift für Literaturwissenschaft und Linguistik, Journal of Medical Internet Research and Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.