Michael Ellsworth
About
Michael Ellsworth has authored 9 papers that have received a total of 246 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Artificial Intelligence. The topics of these papers are Heat Transfer and Optimization (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and 3D IC and TSV technologies (3 papers). Michael Ellsworth is often cited by papers focused on Heat Transfer and Optimization (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in United States and Spain. Michael Ellsworth's co-authors include Richard C. Chu, Robert E. Simons, Collin F. Baker, Roger Schmidt and John F. Eberth and has published in prestigious journals such as Journal of Heat Transfer, IBM Journal of Research and Development and Language Resources and Evaluation.
In The Last Decade
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