L.P. Lehman
Impact in
- General Materials Science top 1%
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Metal Forming Simulation Techniques
Papers in
-
- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 8
-
- Advanced Welding Techniques Analysis 8
- Aluminum Alloys Composites Properties 2
- Intermetallics and Advanced Alloy Properties 2
- Co-authors
- E. J. Cotts (14 shared papers)Thomas R. Bieler (5 shared papers)Yan Xing (4 shared papers)T. Kirkpatrick (2 shared papers)L. Zavalij (4 shared papers)Hairong Jiang (1 shared paper)Seungbae Park (4 shared papers)Donald W. Henderson (3 shared papers)
- Journals
- Journal of Electronic Materials (4 papers)Acta Materialia (2 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- United StatesJapan
In The Last Decade
L.P. Lehman
23 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 36
- General Materials Science 66
- Mechanical Engineering 784
- Electrical and Electronic Engineering 1.2k
- Aerospace Engineering 377
- Mechanics of Materials 275
Countries citing papers authored by L.P. Lehman
This map shows the geographic impact of L.P. Lehman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.P. Lehman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.P. Lehman more than expected).
Fields of papers citing papers by L.P. Lehman
This network shows the impact of papers produced by L.P. Lehman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.P. Lehman. The network helps show where L.P. Lehman may publish in the future.
Co-authors
The 25 scholars most cited alongside L.P. Lehman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 210 | |
| 2 | 2010 | 177 | |
| 3 | 2004 | 170 | |
| 4 | 2004 | 149 | |
| 5 | 2004 | 121 | |
| 6 | 2005 | 96 | |
| 7 | 2007 | 87 | |
| 8 | 2006 | 69 | |
| 9 | 2007 | 51 | |
| 10 | 2007 | 48 | |
| 11 | 2005 | 29 | |
| 12 | 1988 | 23 | |
| 13 | 2004 | 20 | |
| 14 | 2007 | 12 | |
| 15 | 2004 | 11 | |
| 16 | 2008 | 10 | |
| 17 | 2005 | 7 | |
| 18 | 1984 | 6 | |
| 19 | 2002 | 6 | |
| 20 | 2007 | 4 |
About L.P. Lehman
L.P. Lehman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Aerospace Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials, having authored 23 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), Advanced Welding Techniques Analysis (8 papers), 3D IC and TSV technologies (8 papers), Aluminum Alloy Microstructure Properties (7 papers), Metal and Thin Film Mechanics (2 papers), Metallurgy and Material Forming (2 papers), Aluminum Alloys Composites Properties (2 papers) and Intermetallics and Advanced Alloy Properties (2 papers). The work is most often cited by research in General Materials Science (66 citations), Mechanical Engineering (784 citations), Electrical and Electronic Engineering (1.2k citations), Aerospace Engineering (377 citations) and Mechanics of Materials (275 citations). L.P. Lehman has collaborated with scholars based in United States and Japan. Frequent co-authors include E. J. Cotts, Thomas R. Bieler, Yan Xing, T. Kirkpatrick, L. Zavalij, Hairong Jiang, Seungbae Park, Donald W. Henderson, Peter Børgesen and Tia‐Marje Korhonen. Their work appears in journals such as Journal of Electronic Materials, Acta Materialia, Journal of materials research/Pratt's guide to venture capital sources, IEEE Transactions on Components and Packaging Technologies and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.