Huayan Wang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
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- Industrial Vision Systems and Defect Detection
Papers in
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- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 14
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Copper Interconnects and Reliability 5
- Co-authors
- Seungbae Park (17 shared papers)Jiefeng Xu (14 shared papers)Ke Pan (8 shared papers)Jing Wang (4 shared papers)Shuai Shao (2 shared papers)Yuling Niu (2 shared papers)Gamal Refai-Ahmed (7 shared papers)Dan Kyung Suk Oh (1 shared paper)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Packaging (1 paper)Journal of Energy Storage (1 paper)Small (1 paper)ACS Applied Energy Materials (1 paper)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
Huayan Wang
29 papers receiving 410 citations
Peers
Comparison fields: 5 of 50
- Electrical and Electronic Engineering 348
- Industrial and Manufacturing Engineering 38
- Mechanics of Materials 83
- Mechanical Engineering 98
- Hardware and Architecture 16
Countries citing papers authored by Huayan Wang
This map shows the geographic impact of Huayan Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huayan Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huayan Wang more than expected).
Fields of papers citing papers by Huayan Wang
This network shows the impact of papers produced by Huayan Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huayan Wang. The network helps show where Huayan Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Huayan Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 74 | |
| 2 | 2018 | 46 | |
| 3 | 2020 | 27 | |
| 4 | 2020 | 26 | |
| 5 | 2020 | 25 | |
| 6 | 2020 | 23 | |
| 7 | 2019 | 21 | |
| 8 | 2019 | 19 | |
| 9 | 2020 | 18 | |
| 10 | 2019 | 17 | |
| 11 | 2020 | 16 | |
| 12 | 2020 | 14 | |
| 13 | 2020 | 14 | |
| 14 | 2019 | 13 | |
| 15 | 2007 | 11 | |
| 16 | 2016 | 10 | |
| 17 | 2019 | 9 | |
| 18 | 2008 | 9 | |
| 19 | 2019 | 9 | |
| 20 | 2020 | 6 |
About Huayan Wang
Huayan Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Mechanics of Materials and Materials Chemistry, having authored 29 papers that have together received 434 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (14 papers), Copper Interconnects and Reliability (5 papers), Advanced Surface Polishing Techniques (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Adhesion, Friction, and Surface Interactions (2 papers), Quantum Dots Synthesis And Properties (2 papers) and Metal Forming Simulation Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (348 citations), Industrial and Manufacturing Engineering (38 citations), Mechanics of Materials (83 citations), Mechanical Engineering (98 citations) and Hardware and Architecture (16 citations). Huayan Wang has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Seungbae Park, Jiefeng Xu, Ke Pan, Jing Wang, Shuai Shao, Yuling Niu, Gamal Refai-Ahmed, Dan Kyung Suk Oh, Hong Ying Qin and Hongbin Zha. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, Journal of Energy Storage, Small and ACS Applied Energy Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.