Yangyang Lai
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
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- Industrial Vision Systems and Defect Detection
Papers in
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- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 23
- Integrated Circuits and Semiconductor Failure Analysis 4
- Electrostatic Discharge in Electronics 3
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- Metallurgy and Material Forming 3
- Co-authors
- Seungbae Park (30 shared papers)Ke Pan (16 shared papers)Jiefeng Xu (8 shared papers)Chukwudi Okoro (5 shared papers)Scott Pollard (5 shared papers)Stephen R. Cain (1 shared paper)Jing Wang (2 shared papers)Atsushi Takahashi (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)Microelectronics Reliability (3 papers)Journal of Electronic Packaging (1 paper)Journal of Intelligent Manufacturing (1 paper)Soldering and Surface Mount Technology (2 papers)
- Partner nations
- United StatesChina
In The Last Decade
Yangyang Lai
31 papers receiving 262 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 228
- Industrial and Manufacturing Engineering 34
- Mechanical Engineering 83
- Mechanics of Materials 51
- Automotive Engineering 17
Countries citing papers authored by Yangyang Lai
This map shows the geographic impact of Yangyang Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yangyang Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yangyang Lai more than expected).
Fields of papers citing papers by Yangyang Lai
This network shows the impact of papers produced by Yangyang Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yangyang Lai. The network helps show where Yangyang Lai may publish in the future.
Co-authors
The 18 scholars most cited alongside Yangyang Lai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 26 | |
| 2 | 2021 | 22 | |
| 3 | 2021 | 20 | |
| 4 | 2022 | 19 | |
| 5 | 2021 | 17 | |
| 6 | 2022 | 17 | |
| 7 | 2022 | 13 | |
| 8 | 2023 | 11 | |
| 9 | 2022 | 11 | |
| 10 | 2022 | 11 | |
| 11 | 2024 | 10 | |
| 12 | 2022 | 10 | |
| 13 | 2022 | 10 | |
| 14 | 2022 | 9 | |
| 15 | 2022 | 9 | |
| 16 | 2023 | 8 | |
| 17 | 2022 | 8 | |
| 18 | 2023 | 6 | |
| 19 | 2022 | 5 | |
| 20 | 2023 | 4 |
About Yangyang Lai
Yangyang Lai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Automotive Engineering and Biomedical Engineering, having authored 32 papers that have together received 272 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (23 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Additive Manufacturing and 3D Printing Technologies (4 papers), Electrostatic Discharge in Electronics (3 papers), Metallurgy and Material Forming (3 papers), Industrial Vision Systems and Defect Detection (2 papers) and Injection Molding Process and Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (228 citations), Industrial and Manufacturing Engineering (34 citations), Mechanical Engineering (83 citations), Mechanics of Materials (51 citations) and Automotive Engineering (17 citations). Yangyang Lai has collaborated with scholars based in United States and China. Frequent co-authors include Seungbae Park, Ke Pan, Jiefeng Xu, Chukwudi Okoro, Scott Pollard, Stephen R. Cain, Jing Wang, Atsushi Takahashi, Ke Pan and Gamal Refai-Ahmed. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Journal of Electronic Packaging, Journal of Intelligent Manufacturing and Soldering and Surface Mount Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.