Yuling Niu
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 10
- Integrated Circuits and Semiconductor Failure Analysis 4
- Advancements in Photolithography Techniques 3
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- Optical measurement and interference techniques 7
- Co-authors
- Seungbae Park (16 shared papers)Shuai Shao (12 shared papers)Jing Wang (7 shared papers)Huayan Wang (3 shared papers)Gamal Refai-Ahmed (3 shared papers)Huayan Wang (2 shared papers)Jing Wang (1 shared paper)Jiefeng Xu (2 shared papers)
- Journals
- Microelectronics Reliability (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Optics and Lasers in Engineering (1 paper)Sensors (1 paper)Scientific Reports (1 paper)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
Yuling Niu
24 papers receiving 342 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 274
- Industrial and Manufacturing Engineering 26
- Mechanics of Materials 56
- Electronic, Optical and Magnetic Materials 41
- Computer Vision and Pattern Recognition 44
Countries citing papers authored by Yuling Niu
This map shows the geographic impact of Yuling Niu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yuling Niu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yuling Niu more than expected).
Fields of papers citing papers by Yuling Niu
This network shows the impact of papers produced by Yuling Niu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yuling Niu. The network helps show where Yuling Niu may publish in the future.
Co-authors
The 25 scholars most cited alongside Yuling Niu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 44 | |
| 2 | 2018 | 41 | |
| 3 | 2018 | 30 | |
| 4 | 2018 | 29 | |
| 5 | 2020 | 23 | |
| 6 | 2017 | 23 | |
| 7 | A comparison of flipped and traditional classroom learning: a case study in mechanical engineering | 2018 | 21 |
| 8 | 2016 | 19 | |
| 9 | 2020 | 17 | |
| 10 | 2018 | 16 | |
| 11 | 2017 | 15 | |
| 12 | 2015 | 12 | |
| 13 | 2017 | 11 | |
| 14 | 2017 | 10 | |
| 15 | 2018 | 10 | |
| 16 | 2017 | 9 | |
| 17 | 2018 | 9 | |
| 18 | 2016 | 8 | |
| 19 | 2019 | 4 | |
| 20 | 2013 | 3 |
About Yuling Niu
Yuling Niu is a scholar working on Electrical and Electronic Engineering, Computer Vision and Pattern Recognition, Mechanics of Materials, Computational Mechanics and Mechanical Engineering, having authored 26 papers that have together received 363 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers), Optical measurement and interference techniques (7 papers), Surface Roughness and Optical Measurements (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Mechanical Behavior of Composites (3 papers), Advancements in Photolithography Techniques (3 papers) and Advanced Surface Polishing Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (274 citations), Industrial and Manufacturing Engineering (26 citations), Mechanics of Materials (56 citations), Electronic, Optical and Magnetic Materials (41 citations) and Computer Vision and Pattern Recognition (44 citations). Yuling Niu has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Seungbae Park, Shuai Shao, Jing Wang, Huayan Wang, Gamal Refai-Ahmed, Huayan Wang, Jing Wang, Jiefeng Xu, Chin‐Li Kao and Lin Li. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, Optics and Lasers in Engineering, Sensors and Scientific Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.