Ganesh Subbarayan
Impact in
- Mechanics of Materials top 2%
- Numerical methods in engineering
Papers in
-
- Electronic Packaging and Soldering Technologies 90
- 3D IC and TSV technologies 29
-
- Numerical methods in engineering 24
- Composite Material Mechanics 17
- Mechanical Behavior of Composites 15
- Co-authors
- Bahgat Sammakia (23 shared papers)I. Dutta (13 shared papers)Vikas Gupta (4 shared papers)Praveen Kumar (4 shared papers)Xuefeng Zhang (3 shared papers)Thomas Siegmund (10 shared papers)Diane Chan (15 shared papers)Luu Nguyen (13 shared papers)
- Journals
- Journal of Electronic Packaging (22 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (12 papers)Computer Methods in Applied Mechanics and Engineering (11 papers)IEEE Transactions on Components and Packaging Technologies (7 papers)Journal of Electronic Materials (6 papers)
- Partner nations
- United StatesIndiaChina
In The Last Decade
Ganesh Subbarayan
178 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 75
- Computer Graphics and Computer-Aided Design 88
- Mechanics of Materials 610
- Mechanical Engineering 627
- Electrical and Electronic Engineering 906
- Computational Mechanics 280
Countries citing papers authored by Ganesh Subbarayan
This map shows the geographic impact of Ganesh Subbarayan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ganesh Subbarayan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ganesh Subbarayan more than expected).
Fields of papers citing papers by Ganesh Subbarayan
This network shows the impact of papers produced by Ganesh Subbarayan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ganesh Subbarayan. The network helps show where Ganesh Subbarayan may publish in the future.
Co-authors
The 25 scholars most cited alongside Ganesh Subbarayan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 192 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 98 | |
| 2 | 2009 | 86 | |
| 3 | 2008 | 85 | |
| 4 | 2007 | 60 | |
| 5 | 2003 | 59 | |
| 6 | 2005 | 56 | |
| 7 | 1996 | 45 | |
| 8 | 2011 | 45 | |
| 9 | 2008 | 44 | |
| 10 | 2002 | 41 | |
| 11 | 2002 | 33 | |
| 12 | 1996 | 32 | |
| 13 | 2002 | 29 | |
| 14 | 2007 | 29 | |
| 15 | 2019 | 27 | |
| 16 | 2005 | 27 | |
| 17 | 2006 | 26 | |
| 18 | 2000 | 26 | |
| 19 | 2010 | 25 | |
| 20 | 2012 | 25 |
About Ganesh Subbarayan
Ganesh Subbarayan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Computational Mechanics, having authored 192 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (90 papers), 3D IC and TSV technologies (29 papers), Numerical methods in engineering (24 papers), Thermal properties of materials (23 papers), Aluminum Alloy Microstructure Properties (22 papers), Advanced Numerical Analysis Techniques (21 papers), Composite Material Mechanics (17 papers) and Mechanical Behavior of Composites (15 papers). The work is most often cited by research in Computer Graphics and Computer-Aided Design (88 citations), Mechanics of Materials (610 citations), Mechanical Engineering (627 citations), Electrical and Electronic Engineering (906 citations) and Computational Mechanics (280 citations). Ganesh Subbarayan has collaborated with scholars based in United States, India and China. Frequent co-authors include Bahgat Sammakia, I. Dutta, Vikas Gupta, Praveen Kumar, Xuefeng Zhang, Thomas Siegmund, Diane Chan, Luu Nguyen, Li Zhang and Roop L. Mahajan. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, Computer Methods in Applied Mechanics and Engineering, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.