P.L. Tu
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 15
- Integrated Circuits and Semiconductor Failure Analysis 2
-
- Advanced Welding Techniques Analysis 6
- Aluminum Alloys Composites Properties 4
- Intermetallics and Advanced Alloy Properties 2
- Co-authors
- J.K.L. Lai (9 shared papers)Yan Cheong Chan (7 shared papers)K.C. Hung (9 shared papers)Y.C. Chan (7 shared papers)Chengcheng Tang (5 shared papers)A.C.K. So (1 shared paper)Y. C. Chan (1 shared paper)Yiping Wu (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (4 papers)Microelectronics Reliability (3 papers)Journal of Electronic Packaging (2 papers)Intermetallics (1 paper)Scripta Materialia (1 paper)
- Partner nations
- Hong KongUnited StatesChina
In The Last Decade
P.L. Tu
18 papers receiving 530 citations
Peers
Comparison fields: 5 of 28
- General Materials Science 42
- Mechanical Engineering 361
- Electrical and Electronic Engineering 516
- Aerospace Engineering 69
- Mechanics of Materials 47
Countries citing papers authored by P.L. Tu
This map shows the geographic impact of P.L. Tu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P.L. Tu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P.L. Tu more than expected).
Fields of papers citing papers by P.L. Tu
This network shows the impact of papers produced by P.L. Tu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P.L. Tu. The network helps show where P.L. Tu may publish in the future.
Co-authors
The 17 scholars most cited alongside P.L. Tu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 126 | |
| 2 | 1997 | 125 | |
| 3 | 1997 | 58 | |
| 4 | 2001 | 57 | |
| 5 | 2001 | 43 | |
| 6 | 2001 | 37 | |
| 7 | 2000 | 30 | |
| 8 | 2001 | 14 | |
| 9 | Effecto of Intermetallic Compounds on Vibration Fatigue of μBGA Solder Joint | 2001 | 11 |
| 10 | 2001 | 9 | |
| 11 | 1999 | 8 | |
| 12 | 2000 | 8 | |
| 13 | 2002 | 6 | |
| 14 | 2002 | 5 | |
| 15 | 2025 | 3 | |
| 16 | 2011 | 2 | |
| 17 | 2000 | 2 | |
| 18 | 2002 | 2 |
About P.L. Tu
P.L. Tu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, General Materials Science and Materials Chemistry, having authored 18 papers that have together received 546 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (15 papers), Advanced Welding Techniques Analysis (6 papers), Adhesion, Friction, and Surface Interactions (4 papers), Aluminum Alloys Composites Properties (4 papers), Intermetallics and Advanced Alloy Properties (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and MXene and MAX Phase Materials (1 paper). The work is most often cited by research in General Materials Science (42 citations), Mechanical Engineering (361 citations), Electrical and Electronic Engineering (516 citations), Aerospace Engineering (69 citations) and Mechanics of Materials (47 citations). P.L. Tu has collaborated with scholars based in Hong Kong, United States and China. Frequent co-authors include J.K.L. Lai, Yan Cheong Chan, K.C. Hung, Y.C. Chan, Chengcheng Tang, A.C.K. So, Y. C. Chan, Yiping Wu, Hock Chun Ong and Brian W. Knight. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Microelectronics Reliability, Journal of Electronic Packaging, Intermetallics and Scripta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.