A.C.K. So
Impact in
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
- General Materials Science top 10%
- Metallurgical and Alloy Processes
Papers in
-
- Intermetallics and Advanced Alloy Properties 4
- Advancements in Materials Engineering 1
- Aluminum Alloys Composites Properties 1
-
- Electronic Packaging and Soldering Technologies 6
- 3D IC and TSV technologies 3
- Co-authors
- Yan Cheong Chan (5 shared papers)J.K.L. Lai (3 shared papers)Y. C. Chan (1 shared paper)Y.C. Chan (2 shared papers)P.L. Tu (1 shared paper)Xing Dai (1 shared paper)
- Journals
- Optics and Lasers in Engineering (1 paper)Materials Science and Engineering B (1 paper)Applied Optics (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (3 papers)
- Partner nations
- Hong Kong
In The Last Decade
A.C.K. So
8 papers receiving 343 citations
Peers
Comparison fields: 5 of 21
- Mechanical Engineering 252
- General Materials Science 20
- Electrical and Electronic Engineering 334
- Aerospace Engineering 54
- Electronic, Optical and Magnetic Materials 16
Countries citing papers authored by A.C.K. So
This map shows the geographic impact of A.C.K. So's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A.C.K. So with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A.C.K. So more than expected).
Fields of papers citing papers by A.C.K. So
This network shows the impact of papers produced by A.C.K. So. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A.C.K. So. The network helps show where A.C.K. So may publish in the future.
Co-authors
The 6 scholars most cited alongside A.C.K. So, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1998 | 143 | |
| 2 | 1996 | 74 | |
| 3 | 1997 | 58 | |
| 4 | 1997 | 54 | |
| 5 | 2004 | 9 | |
| 6 | 2002 | 8 | |
| 7 | 1999 | 6 | |
| 8 | 2002 | 2 |
About A.C.K. So
A.C.K. So is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, General Materials Science, Computational Mechanics and Computer Vision and Pattern Recognition, having authored 8 papers that have together received 354 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), Intermetallics and Advanced Alloy Properties (4 papers), 3D IC and TSV technologies (3 papers), Advancements in Materials Engineering (1 paper), Image and Signal Denoising Methods (1 paper), Aluminum Alloy Microstructure Properties (1 paper), Surface Roughness and Optical Measurements (1 paper) and Aluminum Alloys Composites Properties (1 paper). The work is most often cited by research in Mechanical Engineering (252 citations), General Materials Science (20 citations), Electrical and Electronic Engineering (334 citations), Aerospace Engineering (54 citations) and Electronic, Optical and Magnetic Materials (16 citations). A.C.K. So has collaborated with scholars based in Hong Kong. Frequent co-authors include Yan Cheong Chan, J.K.L. Lai, Y. C. Chan, Y.C. Chan, P.L. Tu and Xing Dai. Their work appears in journals such as Optics and Lasers in Engineering, Materials Science and Engineering B, Applied Optics and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.