Ning-Cheng Lee
Impact in
- General Materials Science top 5%
- Metallurgical and Alloy Processes
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 64
- 3D IC and TSV technologies 44
- Nanomaterials and Printing Technologies 5
-
- Aluminum Alloys Composites Properties 16
- Intermetallics and Advanced Alloy Properties 15
- Advanced Welding Techniques Analysis 9
- Metal Forming Simulation Techniques 4
- Co-authors
- Weiping Liu (8 shared papers)John H. Lau (3 shared papers)Yi‐Shao Lai (4 shared papers)Jenn‐Ming Song (4 shared papers)Ying-Ta Chiu (4 shared papers)Jun-Yen Uan (1 shared paper)Sihai Chen (8 shared papers)Hong‐Sik Hwang (3 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Materials (1 paper)International Journal of Damage Mechanics (1 paper)Review of Scientific Instruments (1 paper)IEEE Power Electronics Magazine (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Ning-Cheng Lee
67 papers receiving 540 citations
Peers
Comparison fields: 5 of 39
- General Materials Science 33
- Electrical and Electronic Engineering 556
- Mechanical Engineering 352
- Aerospace Engineering 59
- Mechanics of Materials 49
Countries citing papers authored by Ning-Cheng Lee
This map shows the geographic impact of Ning-Cheng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ning-Cheng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ning-Cheng Lee more than expected).
Fields of papers citing papers by Ning-Cheng Lee
This network shows the impact of papers produced by Ning-Cheng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ning-Cheng Lee. The network helps show where Ning-Cheng Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Ning-Cheng Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 77 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 75 | |
| 2 | 2008 | 66 | |
| 3 | 2018 | 65 | |
| 4 | 2020 | 46 | |
| 5 | 2009 | 35 | |
| 6 | 2011 | 19 | |
| 7 | 2007 | 14 | |
| 8 | 2018 | 13 | |
| 9 | 2016 | 12 | |
| 10 | 2008 | 12 | |
| 11 | 2003 | 11 | |
| 12 | 2012 | 10 | |
| 13 | 2010 | 10 | |
| 14 | 2009 | 10 | |
| 15 | 2014 | 9 | |
| 16 | A Novel Lead-Free Solder Replacement | 1994 | 9 |
| 17 | 2021 | 8 | |
| 18 | 2006 | 7 | |
| 19 | 2007 | 7 | |
| 20 | 2003 | 7 |
About Ning-Cheng Lee
Ning-Cheng Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Automotive Engineering and General Materials Science, having authored 77 papers that have together received 584 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (64 papers), 3D IC and TSV technologies (44 papers), Aluminum Alloys Composites Properties (16 papers), Intermetallics and Advanced Alloy Properties (15 papers), Advanced Welding Techniques Analysis (9 papers), Nanomaterials and Printing Technologies (5 papers), Metallurgical and Alloy Processes (5 papers) and Metal Forming Simulation Techniques (4 papers). The work is most often cited by research in General Materials Science (33 citations), Electrical and Electronic Engineering (556 citations), Mechanical Engineering (352 citations), Aerospace Engineering (59 citations) and Mechanics of Materials (49 citations). Ning-Cheng Lee has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Weiping Liu, John H. Lau, Yi‐Shao Lai, Jenn‐Ming Song, Ying-Ta Chiu, Jun-Yen Uan, Sihai Chen, Hong‐Sik Hwang, Anthony Gallagher and Scott Chen. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, International Journal of Damage Mechanics, Review of Scientific Instruments and IEEE Power Electronics Magazine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.