Y.C. Chan
Impact in
- General Materials Science top 0.2%
- Metallurgical and Alloy Processes
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 148
- 3D IC and TSV technologies 99
- Integrated Circuits and Semiconductor Failure Analysis 10
-
- Advanced Welding Techniques Analysis 35
- Intermetallics and Advanced Alloy Properties 30
- Aluminum Alloys Composites Properties 16
- Co-authors
- M.O. Alam (24 shared papers)Jun Shen (4 shared papers)Ahmed Sharif (15 shared papers)Asit Kumar Gain (8 shared papers)Daoguo Yang (3 shared papers)Bin Wu (16 shared papers)Mobinul Islam (7 shared papers)J.K.L. Lai (15 shared papers)
- Journals
- Microelectronics Reliability (17 papers)Journal of Alloys and Compounds (16 papers)Journal of Electronic Materials (13 papers)Journal of Materials Science Materials in Electronics (12 papers)Materials Science and Engineering B (9 papers)
- Partner nations
- Hong KongChinaUnited Kingdom
In The Last Decade
Y.C. Chan
183 papers receiving 4.8k citations
Peers
Comparison fields: 5 of 87
- General Materials Science 248
- Electrical and Electronic Engineering 4.4k
- Mechanical Engineering 2.9k
- Electronic, Optical and Magnetic Materials 371
- Aerospace Engineering 467
Countries citing papers authored by Y.C. Chan
This map shows the geographic impact of Y.C. Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y.C. Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y.C. Chan more than expected).
Fields of papers citing papers by Y.C. Chan
This network shows the impact of papers produced by Y.C. Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y.C. Chan. The network helps show where Y.C. Chan may publish in the future.
Co-authors
The 25 scholars most cited alongside Y.C. Chan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 185 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 238 | |
| 2 | 2008 | 207 | |
| 3 | 2005 | 132 | |
| 4 | 2010 | 126 | |
| 5 | 2001 | 126 | |
| 6 | 2015 | 117 | |
| 7 | 2005 | 110 | |
| 8 | 2011 | 106 | |
| 9 | 2003 | 96 | |
| 10 | 2006 | 86 | |
| 11 | 2005 | 83 | |
| 12 | 2003 | 82 | |
| 13 | 1999 | 81 | |
| 14 | 2013 | 78 | |
| 15 | 2003 | 74 | |
| 16 | 2008 | 74 | |
| 17 | 2008 | 71 | |
| 18 | 2014 | 70 | |
| 19 | 2010 | 69 | |
| 20 | 2009 | 65 |
About Y.C. Chan
Y.C. Chan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 185 papers that have together received 4.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (148 papers), 3D IC and TSV technologies (99 papers), Advanced Welding Techniques Analysis (35 papers), Intermetallics and Advanced Alloy Properties (30 papers), Aluminum Alloys Composites Properties (16 papers), Copper Interconnects and Reliability (16 papers), Adhesion, Friction, and Surface Interactions (14 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). The work is most often cited by research in General Materials Science (248 citations), Electrical and Electronic Engineering (4.4k citations), Mechanical Engineering (2.9k citations), Electronic, Optical and Magnetic Materials (371 citations) and Aerospace Engineering (467 citations). Y.C. Chan has collaborated with scholars based in Hong Kong, China and United Kingdom. Frequent co-authors include M.O. Alam, Jun Shen, Ahmed Sharif, Asit Kumar Gain, Daoguo Yang, Bin Wu, Mobinul Islam, J.K.L. Lai, W. Jillek and K.C. Hung. Their work appears in journals such as Microelectronics Reliability, Journal of Alloys and Compounds, Journal of Electronic Materials, Journal of Materials Science Materials in Electronics and Materials Science and Engineering B.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.