Clair Webb
Impact in
- Hardware and Architecture top 2%
- Parallel Computing and Optimization Techniques
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- Interconnection Networks and Systems
- Advanced Data Storage Technologies
Papers in
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- 3D IC and TSV technologies 7
- Semiconductor materials and devices 6
- Low-power high-performance VLSI design 5
- VLSI and FPGA Design Techniques 3
- Advancements in Photolithography Techniques 3
- Advancements in Semiconductor Devices and Circuit Design 3
- Advanced Memory and Neural Computing 2
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- VLSI and Analog Circuit Testing 3
- Co-authors
- Bryan Black (3 shared papers)Donald W. Nelson (2 shared papers)Gabriel H. Loh (1 shared paper)P. Morrow (1 shared paper)John Paul Shen (1 shared paper)J. DeVale (1 shared paper)Daniel Pantuso (1 shared paper)Paul A. Reed (1 shared paper)
- Journals
- Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Electrical Performance of Electronic Packaging (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (2 papers)MRS Proceedings (1 paper)
- Partner nations
- United StatesUnited Kingdom
In The Last Decade
Clair Webb
14 papers receiving 769 citations
Clair Webb's Hit Papers
Peers
Comparison fields: 5 of 29
- Hardware and Architecture 355
- Computer Networks and Communications 354
- Electrical and Electronic Engineering 668
- Automotive Engineering 34
- Information Systems 26
Countries citing papers authored by Clair Webb
This map shows the geographic impact of Clair Webb's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Clair Webb with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Clair Webb more than expected).
Fields of papers citing papers by Clair Webb
This network shows the impact of papers produced by Clair Webb. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Clair Webb. The network helps show where Clair Webb may publish in the future.
Co-authors
The 25 scholars most cited alongside Clair Webb, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Die Stacking (3D) Microarchitecture Hit paper breakdown → | 2006 | 449 |
| 2 | 2004 | 134 | |
| 3 | 2006 | 64 | |
| 4 | 2003 | 34 | |
| 5 | 2006 | 30 | |
| 6 | 2004 | 25 | |
| 7 | 2009 | 17 | |
| 8 | 2013 | 14 | |
| 9 | 2008 | 12 | |
| 10 | 2003 | 8 | |
| 11 | 2008 | 7 | |
| 12 | 1984 | 5 | |
| 13 | 2006 | 3 | |
| 14 | 1986 | 3 | |
| 15 | 1984 | 2 | |
| 16 | Implementing Multiple ADC Systems in a High Production Sub-Half Micron Microprocessor Fab | 1999 | 0 |
About Clair Webb
Clair Webb is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Biomedical Engineering, Computer Networks and Communications and Automotive Engineering, having authored 16 papers that have together received 807 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (7 papers), Semiconductor materials and devices (6 papers), Low-power high-performance VLSI design (5 papers), VLSI and FPGA Design Techniques (3 papers), Advancements in Photolithography Techniques (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), VLSI and Analog Circuit Testing (3 papers) and Advanced Memory and Neural Computing (2 papers). The work is most often cited by research in Hardware and Architecture (355 citations), Computer Networks and Communications (354 citations), Electrical and Electronic Engineering (668 citations), Automotive Engineering (34 citations) and Information Systems (26 citations). Clair Webb has collaborated with scholars based in United States and United Kingdom. Frequent co-authors include Bryan Black, Donald W. Nelson, Gabriel H. Loh, P. Morrow, John Paul Shen, J. DeVale, Daniel Pantuso, Paul A. Reed, Lei Jiang and Sadasivan Shankar. Their work appears in journals such as Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, IEEE Journal of Solid-State Circuits, Electrical Performance of Electronic Packaging, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.