Christopher Jezewski
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electrodeposition and Electroless Coatings
- Molecular Junctions and Nanostructures
Papers in
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- Semiconductor materials and devices 21
- Electronic Packaging and Soldering Technologies 3
- 3D IC and TSV technologies 3
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- Copper Interconnects and Reliability 20
- Co-authors
- Jay J. Senkevich (12 shared papers)Toh‐Ming Lu (8 shared papers)W. A. Lanford (8 shared papers)Fu Tang (4 shared papers)G.-C. Wang (4 shared papers)Samuk Pimanpang (2 shared papers)T.‐M. Lu (2 shared papers)Jason T. Drotar (1 shared paper)
- Journals
- Chemical Vapor Deposition (5 papers)Journal of The Electrochemical Society (4 papers)Thin Solid Films (1 paper)Applied Physics A (1 paper)Microscopy and Microanalysis (1 paper)
- Partner nations
- United StatesSwitzerlandNetherlands
In The Last Decade
Christopher Jezewski
25 papers receiving 419 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 145
- Electrical and Electronic Engineering 344
- Materials Chemistry 219
- Structural Biology 5
- Surfaces, Coatings and Films 23
Countries citing papers authored by Christopher Jezewski
This map shows the geographic impact of Christopher Jezewski's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Christopher Jezewski with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Christopher Jezewski more than expected).
Fields of papers citing papers by Christopher Jezewski
This network shows the impact of papers produced by Christopher Jezewski. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Christopher Jezewski. The network helps show where Christopher Jezewski may publish in the future.
Co-authors
The 25 scholars most cited alongside Christopher Jezewski, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 61 | |
| 2 | 2005 | 59 | |
| 3 | 2005 | 53 | |
| 4 | 2005 | 37 | |
| 5 | 2014 | 29 | |
| 6 | 2004 | 24 | |
| 7 | 2020 | 21 | |
| 8 | 2005 | 17 | |
| 9 | 2002 | 16 | |
| 10 | 2014 | 14 | |
| 11 | 2012 | 14 | |
| 12 | 2015 | 12 | |
| 13 | 2013 | 12 | |
| 14 | 2024 | 11 | |
| 15 | 2004 | 11 | |
| 16 | 2024 | 8 | |
| 17 | 1997 | 8 | |
| 18 | 2003 | 7 | |
| 19 | 2012 | 6 | |
| 20 | 2005 | 5 |
About Christopher Jezewski
Christopher Jezewski is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 28 papers that have together received 432 indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (20 papers), Metal and Thin Film Mechanics (8 papers), Electronic Packaging and Soldering Technologies (3 papers), Thermal properties of materials (3 papers), 3D IC and TSV technologies (3 papers), Nanofabrication and Lithography Techniques (2 papers) and Corrosion Behavior and Inhibition (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (145 citations), Electrical and Electronic Engineering (344 citations), Materials Chemistry (219 citations), Structural Biology (5 citations) and Surfaces, Coatings and Films (23 citations). Christopher Jezewski has collaborated with scholars based in United States, Switzerland and Netherlands. Frequent co-authors include Jay J. Senkevich, Toh‐Ming Lu, W. A. Lanford, Fu Tang, G.-C. Wang, Samuk Pimanpang, T.‐M. Lu, Jason T. Drotar, David J. Rogers and Gregory A. Ten Eyck. Their work appears in journals such as Chemical Vapor Deposition, Journal of The Electrochemical Society, Thin Solid Films, Applied Physics A and Microscopy and Microanalysis.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.