Yingxia Liu

71 papers and 1.2k indexed citations i.

About

Yingxia Liu has authored 71 papers that have received a total of 1.2k indexed citations. This includes 41 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 15 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (7 papers). Yingxia Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in China, Hong Kong and United States. Yingxia Liu's co-authors include Xiuchen Zhao, K. N. Tu, Chengwen Tan, K. N. Tu and Lan Guo and has published in prestigious journals such as Advanced Materials, The Journal of Chemical Physics and Applied Physics Letters.

In The Last Decade

Fields of papers published by Yingxia Liu

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Yingxia Liu

Since Specialization
Citations
Rankless by CCL
2025