Chih Chen
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 169
- 3D IC and TSV technologies 102
- Electrodeposition and Electroless Coatings 24
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- Copper Interconnects and Reliability 43
- Co-authors
- K. N. Tu (64 shared papers)K. N. Tu (22 shared papers)Chien-Min Liu (29 shared papers)Hsiang‐Yao Hsiao (9 shared papers)C. Y. Liu (5 shared papers)Yi-Sa Huang (10 shared papers)Shuqi Liang (13 shared papers)Hanwen Lin (14 shared papers)
- Journals
- Applied Physics Letters (21 papers)Journal of Applied Physics (20 papers)Journal of Materials Research and Technology (19 papers)Journal of Electronic Materials (18 papers)Materials (16 papers)
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Chih Chen
331 papers receiving 7.4k citations
Chih Chen's Hit Papers
Peers
Comparison fields: 5 of 72
- Electrical and Electronic Engineering 5.9k
- Electronic, Optical and Magnetic Materials 840
- Materials Chemistry 1.1k
- General Materials Science 64
- Renewable Energy, Sustainability and the Environment 267
Countries citing papers authored by Chih Chen
This map shows the geographic impact of Chih Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chih Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chih Chen more than expected).
Fields of papers citing papers by Chih Chen
This network shows the impact of papers produced by Chih Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chih Chen. The network helps show where Chih Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Chih Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 352 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper Hit paper breakdown → | 2012 | 345 |
| 2 | 2010 | 243 | |
| 3 | 2015 | 217 | |
| 4 | 2012 | 163 | |
| 5 | 2012 | 145 | |
| 6 | 1999 | 141 | |
| 7 | 2000 | 139 | |
| 8 | 2000 | 137 | |
| 9 | 2023 | 128 | |
| 10 | 2012 | 119 | |
| 11 | 2014 | 108 | |
| 12 | 2018 | 96 | |
| 13 | 2012 | 95 | |
| 14 | 2004 | 91 | |
| 15 | 2015 | 91 | |
| 16 | 2018 | 86 | |
| 17 | 2021 | 84 | |
| 18 | 2006 | 83 | |
| 19 | 2001 | 80 | |
| 20 | 2006 | 80 |
About Chih Chen
Chih Chen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Mechanics of Materials and Renewable Energy, Sustainability and the Environment, having authored 352 papers that have together received 7.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (169 papers), 3D IC and TSV technologies (102 papers), Copper Interconnects and Reliability (43 papers), Microstructure and mechanical properties (42 papers), Electrodeposition and Electroless Coatings (24 papers), Anodic Oxide Films and Nanostructures (14 papers), Copper-based nanomaterials and applications (12 papers) and Metal and Thin Film Mechanics (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (5.9k citations), Electronic, Optical and Magnetic Materials (840 citations), Materials Chemistry (1.1k citations), General Materials Science (64 citations) and Renewable Energy, Sustainability and the Environment (267 citations). Chih Chen has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include K. N. Tu, K. N. Tu, Chien-Min Liu, Hsiang‐Yao Hsiao, C. Y. Liu, Yi-Sa Huang, Shuqi Liang, Hanwen Lin, T. L. Shao and Chia-Ling Lu. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Journal of Materials Research and Technology, Journal of Electronic Materials and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.