Chih Chen
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
Papers in
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- Electronic Packaging and Soldering Technologies 209
- 3D IC and TSV technologies 173
- Semiconductor materials and devices 26
- Electrodeposition and Electroless Coatings 23
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- Copper Interconnects and Reliability 138
- Co-authors
- K. N. Tu (62 shared papers)K. N. Tu (23 shared papers)Chien-Min Liu (22 shared papers)Hsiang‐Yao Hsiao (9 shared papers)Dinh-Phuc Tran (63 shared papers)Yi-Sa Huang (7 shared papers)Han-wen Lin (9 shared papers)Chia-Ling Lu (8 shared papers)
- Journals
- Applied Physics Letters (21 papers)Journal of Applied Physics (20 papers)Journal of Electronic Materials (18 papers)Journal of Materials Research and Technology (17 papers)Materials (15 papers)
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Chih Chen
301 papers receiving 6.7k citations
Peers
Comparison fields: 5 of 106
- Electronic, Optical and Magnetic Materials 2.5k
- Electrical and Electronic Engineering 5.5k
- Mechanical Engineering 2.1k
- General Materials Science 133
- Materials Chemistry 1.5k
Countries citing papers authored by Chih Chen
This map shows the geographic impact of Chih Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chih Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chih Chen more than expected).
Fields of papers citing papers by Chih Chen
This network shows the impact of papers produced by Chih Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chih Chen. The network helps show where Chih Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Chih Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 315 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 331 | |
| 2 | 2010 | 230 | |
| 3 | 2015 | 200 | |
| 4 | 2012 | 153 | |
| 5 | 1999 | 135 | |
| 6 | 2000 | 134 | |
| 7 | 2012 | 134 | |
| 8 | 2000 | 125 | |
| 9 | 2012 | 111 | |
| 10 | 2023 | 107 | |
| 11 | 2014 | 101 | |
| 12 | 2012 | 91 | |
| 13 | 2004 | 89 | |
| 14 | 2018 | 89 | |
| 15 | 2015 | 82 | |
| 16 | 2018 | 80 | |
| 17 | 2001 | 78 | |
| 18 | 2021 | 74 | |
| 19 | 2006 | 74 | |
| 20 | 2016 | 73 |
About Chih Chen
Chih Chen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Materials Chemistry and Mechanics of Materials, having authored 315 papers that have together received 6.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (209 papers), 3D IC and TSV technologies (173 papers), Copper Interconnects and Reliability (138 papers), Aluminum Alloys Composites Properties (42 papers), Microstructure and mechanical properties (39 papers), Metal and Thin Film Mechanics (32 papers), Semiconductor materials and devices (26 papers) and Electrodeposition and Electroless Coatings (23 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (2.5k citations), Electrical and Electronic Engineering (5.5k citations), Mechanical Engineering (2.1k citations), General Materials Science (133 citations) and Materials Chemistry (1.5k citations). Chih Chen has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include K. N. Tu, K. N. Tu, Chien-Min Liu, Hsiang‐Yao Hsiao, Dinh-Phuc Tran, Yi-Sa Huang, Han-wen Lin, Chia-Ling Lu, T. L. Shao and Hua-Ching Tong. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Journal of Electronic Materials, Journal of Materials Research and Technology and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.