Chih Chen
About
Chih Chen has authored 230 papers that have received a total of 4.8k indexed citations.
This includes 196 papers in Electrical and Electronic Engineering, 104 papers in Electronic, Optical and Magnetic Materials and 60 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (147 papers), 3D IC and TSV technologies (122 papers) and Copper Interconnects and Reliability (98 papers). Chih Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (147 papers), 3D IC and TSV technologies (122 papers) and Copper Interconnects and Reliability (98 papers) and collaborates with scholars based in Taiwan, United States and Italy. Chih Chen's co-authors include K. N. Tu, Chien-Min Liu, K. N. Tu, Dinh-Phuc Tran and T. L. Shao and has published in prestigious journals such as Science, Journal of the American Chemical Society and Applied Physics Letters.
In The Last Decade
Fields of papers published by Chih Chen
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Chih Chen
Since SpecializationCitations
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