S.A. Gee
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
-
- Copper Interconnects and Reliability
Papers in
-
- Electronic Packaging and Soldering Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 6
- Electrostatic Discharge in Electronics 5
- 3D IC and TSV technologies 5
- Advanced MEMS and NEMS Technologies 3
- Co-authors
- Luu Nguyen (4 shared papers)Chris van Kessel (2 shared papers)Jeremiah G. Murphy (1 shared paper)K. N. Tu (1 shared paper)King-Ning Tu (1 shared paper)M. R. Johnson (2 shared papers)Jeffrey C. Suhling (1 shared paper)R.C. Jaeger (1 shared paper)
- Journals
- Applied Physics Letters (2 papers)Journal of Electronic Packaging (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (4 papers)
- Partner nations
- United StatesNetherlandsItaly
In The Last Decade
S.A. Gee
15 papers receiving 407 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 391
- Electronic, Optical and Magnetic Materials 122
- Mechanics of Materials 69
- General Materials Science 8
- Mechanical Engineering 86
Countries citing papers authored by S.A. Gee
This map shows the geographic impact of S.A. Gee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.A. Gee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.A. Gee more than expected).
Fields of papers citing papers by S.A. Gee
This network shows the impact of papers produced by S.A. Gee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.A. Gee. The network helps show where S.A. Gee may publish in the future.
Co-authors
The 10 scholars most cited alongside S.A. Gee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 138 | |
| 2 | 1983 | 73 | |
| 3 | 1989 | 54 | |
| 4 | 2005 | 36 | |
| 5 | 1991 | 32 | |
| 6 | 1997 | 17 | |
| 7 | 1995 | 16 | |
| 8 | 1993 | 16 | |
| 9 | 2002 | 9 | |
| 10 | 1995 | 9 | |
| 11 | 1987 | 8 | |
| 12 | 2005 | 8 | |
| 13 | 2002 | 5 | |
| 14 | 1982 | 3 | |
| 15 | 1997 | 3 | |
| 16 | 1981 | 2 |
About S.A. Gee
S.A. Gee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Computational Mechanics, having authored 16 papers that have together received 429 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Electrostatic Discharge in Electronics (5 papers), 3D IC and TSV technologies (5 papers), Advanced MEMS and NEMS Technologies (3 papers), Copper Interconnects and Reliability (3 papers), Laser Material Processing Techniques (2 papers) and Advanced Surface Polishing Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (391 citations), Electronic, Optical and Magnetic Materials (122 citations), Mechanics of Materials (69 citations), General Materials Science (8 citations) and Mechanical Engineering (86 citations). S.A. Gee has collaborated with scholars based in United States, Netherlands and Italy. Frequent co-authors include Luu Nguyen, Chris van Kessel, Jeremiah G. Murphy, K. N. Tu, King-Ning Tu, M. R. Johnson, Jeffrey C. Suhling, R.C. Jaeger, J. F. Gibbons and R. Falster. Their work appears in journals such as Applied Physics Letters, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, IEEE Transactions on Components Packaging and Manufacturing Technology Part A and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.