Yu-Po Wang
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Measurements
Papers in
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- 3D IC and TSV technologies 54
- Electronic Packaging and Soldering Technologies 46
- Electromagnetic Compatibility and Noise Suppression 12
- Semiconductor Lasers and Optical Devices 5
- Integrated Circuits and Semiconductor Failure Analysis 5
- Co-authors
- Jung-Pin Lai (3 shared papers)Ping‐Feng Pai (3 shared papers)Nicholas Kao (11 shared papers)Eric He (6 shared papers)Chih‐Ming Chen (2 shared papers)Li‐Chi Huang (2 shared papers)Jay Li (4 shared papers)Andrew H. Kang (12 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (2 papers)Materials Characterization (1 paper)Micromachines (3 papers)Chinese Medical Journal (1 paper)IMAPSource Proceedings (3 papers)
In The Last Decade
Yu-Po Wang
66 papers receiving 311 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 235
- Hardware and Architecture 20
- Nuclear Energy and Engineering 1
- Automotive Engineering 23
- Industrial and Manufacturing Engineering 19
Countries citing papers authored by Yu-Po Wang
This map shows the geographic impact of Yu-Po Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu-Po Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu-Po Wang more than expected).
Fields of papers citing papers by Yu-Po Wang
This network shows the impact of papers produced by Yu-Po Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu-Po Wang. The network helps show where Yu-Po Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Yu-Po Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 79 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 41 | |
| 2 | 2020 | 20 | |
| 3 | 2021 | 17 | |
| 4 | 2019 | 14 | |
| 5 | 2007 | 13 | |
| 6 | 2021 | 12 | |
| 7 | 2022 | 10 | |
| 8 | 2018 | 10 | |
| 9 | 2017 | 10 | |
| 10 | 2002 | 10 | |
| 11 | 2020 | 10 | |
| 12 | 2021 | 9 | |
| 13 | 2022 | 9 | |
| 14 | 2008 | 9 | |
| 15 | 2023 | 8 | |
| 16 | 2020 | 7 | |
| 17 | 2021 | 5 | |
| 18 | 2019 | 5 | |
| 19 | 2020 | 5 | |
| 20 | 2019 | 5 |
About Yu-Po Wang
Yu-Po Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Industrial and Manufacturing Engineering, Automotive Engineering and Hardware and Architecture, having authored 79 papers that have together received 327 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (54 papers), Electronic Packaging and Soldering Technologies (46 papers), Electromagnetic Compatibility and Noise Suppression (12 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Manufacturing Process and Optimization (7 papers), VLSI and Analog Circuit Testing (6 papers), Semiconductor Lasers and Optical Devices (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (235 citations), Hardware and Architecture (20 citations), Nuclear Energy and Engineering (1 citation), Automotive Engineering (23 citations) and Industrial and Manufacturing Engineering (19 citations). Yu-Po Wang has collaborated with scholars based in Taiwan and China. Frequent co-authors include Jung-Pin Lai, Ping‐Feng Pai, Nicholas Kao, Eric He, Chih‐Ming Chen, Li‐Chi Huang, Jay Li, Andrew H. Kang, David Ho and Simon Chen. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Materials Characterization, Micromachines, Chinese Medical Journal and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.