D. Ingerly
Impact in
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- VLSI and FPGA Design Techniques
- Low-power high-performance VLSI design
Papers in
-
- 3D IC and TSV technologies 5
- Advancements in Semiconductor Devices and Circuit Design 1
- Integrated Circuits and Semiconductor Failure Analysis 1
- Silicon Carbide Semiconductor Technologies 1
- Electronic Packaging and Soldering Technologies 1
-
- Parallel Computing and Optimization Techniques 2
- Embedded Systems Design Techniques 1
- Co-authors
- Frank O’Mahony (2 shared papers)Wilfred Gomes (2 shared papers)Ajay Balankutty (1 shared paper)Martin Dixon (1 shared paper)Lei Jiang (1 shared paper)Rajesh Kumar (1 shared paper)Tejas Shah (1 shared paper)Arun G. Chandrasekhar (1 shared paper)
- Journals
- Superconductor Science and Technology (1 paper)2022 IEEE International Solid- State Circuits Conference (ISSCC) (1 paper)
- Partner nations
- United StatesIndiaGreece
In The Last Decade
D. Ingerly
6 papers receiving 153 citations
Peers
Comparison fields: 5 of 33
- Hardware and Architecture 34
- Electrical and Electronic Engineering 132
- Computer Networks and Communications 36
- Electronic, Optical and Magnetic Materials 15
- Automotive Engineering 7
Countries citing papers authored by D. Ingerly
This map shows the geographic impact of D. Ingerly's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Ingerly with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Ingerly more than expected).
Fields of papers citing papers by D. Ingerly
This network shows the impact of papers produced by D. Ingerly. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Ingerly. The network helps show where D. Ingerly may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Ingerly, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 71 | |
| 2 | 2022 | 67 | |
| 3 | 2020 | 11 | |
| 4 | 2016 | 11 | |
| 5 | Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects | 2004 | 2 |
| 6 | 1995 | 1 |
About D. Ingerly
D. Ingerly is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Condensed Matter Physics and Radiation, having authored 6 papers that have together received 163 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Parallel Computing and Optimization Techniques (2 papers), Advancements in Semiconductor Devices and Circuit Design (1 paper), Copper Interconnects and Reliability (1 paper), Integrated Circuits and Semiconductor Failure Analysis (1 paper), Silicon Carbide Semiconductor Technologies (1 paper), Embedded Systems Design Techniques (1 paper) and Electronic Packaging and Soldering Technologies (1 paper). The work is most often cited by research in Hardware and Architecture (34 citations), Electrical and Electronic Engineering (132 citations), Computer Networks and Communications (36 citations), Electronic, Optical and Magnetic Materials (15 citations) and Automotive Engineering (7 citations). D. Ingerly has collaborated with scholars based in United States, India and Greece. Frequent co-authors include Frank O’Mahony, Wilfred Gomes, Ajay Balankutty, Martin Dixon, Lei Jiang, Rajesh Kumar, Tejas Shah, Arun G. Chandrasekhar, Eric Karl and P. Yashar. Their work appears in journals such as Superconductor Science and Technology and 2022 IEEE International Solid- State Circuits Conference (ISSCC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.