D. Ingerly
Impact in
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Low-power high-performance VLSI design
- Advanced Memory and Neural Computing
- VLSI and FPGA Design Techniques
Papers in
-
- 3D IC and TSV technologies 5
- Semiconductor materials and devices 1
-
- Parallel Computing and Optimization Techniques 2
- Embedded Systems Design Techniques 1
- Co-authors
- Wilfred Gomes (2 shared papers)Frank O’Mahony (2 shared papers)Martin Dixon (1 shared paper)Ajay Balankutty (1 shared paper)Rajesh Kumar (1 shared paper)Lei Jiang (1 shared paper)Tejas Shah (1 shared paper)Eric Karl (1 shared paper)
- Journals
- Superconductor Science and Technology (1 paper)2022 IEEE International Solid- State Circuits Conference (ISSCC) (1 paper)
- Partner nations
- United StatesIndia
In The Last Decade
D. Ingerly
6 papers receiving 135 citations
Peers
Comparison fields: 5 of 33
- Hardware and Architecture 33
- Electrical and Electronic Engineering 106
- Computer Networks and Communications 35
- Electronic, Optical and Magnetic Materials 11
- Automotive Engineering 6
Countries citing papers authored by D. Ingerly
This map shows the geographic impact of D. Ingerly's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Ingerly with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Ingerly more than expected).
Fields of papers citing papers by D. Ingerly
This network shows the impact of papers produced by D. Ingerly. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Ingerly. The network helps show where D. Ingerly may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Ingerly, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 59 | |
| 2 | 2020 | 58 | |
| 3 | 2016 | 9 | |
| 4 | 2020 | 8 | |
| 5 | Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects | 2004 | 2 |
| 6 | 1995 | 1 |
About D. Ingerly
D. Ingerly is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Condensed Matter Physics and Radiation, having authored 6 papers that have together received 137 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Parallel Computing and Optimization Techniques (2 papers), Embedded Systems Design Techniques (1 paper), Interconnection Networks and Systems (1 paper), Physics of Superconductivity and Magnetism (1 paper), X-ray Spectroscopy and Fluorescence Analysis (1 paper), Semiconductor materials and devices (1 paper) and Copper Interconnects and Reliability (1 paper). The work is most often cited by research in Hardware and Architecture (33 citations), Electrical and Electronic Engineering (106 citations), Computer Networks and Communications (35 citations), Electronic, Optical and Magnetic Materials (11 citations) and Automotive Engineering (6 citations). D. Ingerly has collaborated with scholars based in United States and India. Frequent co-authors include Wilfred Gomes, Frank O’Mahony, Martin Dixon, Ajay Balankutty, Rajesh Kumar, Lei Jiang, Tejas Shah, Eric Karl, Arun G. Chandrasekhar and K. Fischer. Their work appears in journals such as Superconductor Science and Technology and 2022 IEEE International Solid- State Circuits Conference (ISSCC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.