Robert E. Simons
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Hardware and Architecture top 10%
- Parallel Computing and Optimization Techniques
Papers in
-
- Heat Transfer and Optimization 30
- Heat Transfer and Boiling Studies 11
- Heat Transfer Mechanisms 9
-
- Electronic Packaging and Soldering Technologies 6
- 3D IC and TSV technologies 5
- Co-authors
- Richard C. Chu (18 shared papers)Michael Ellsworth (7 shared papers)Roger Schmidt (8 shared papers)Vincent W. Antonetti (4 shared papers)G. Chrysler (4 shared papers)Madhusudan Iyengar (8 shared papers)Mark Schultz (6 shared papers)Pritish R. Parida (6 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (1 paper)Journal of Electronic Packaging (1 paper)IBM Journal of Research and Development (1 paper)Journal of Heat Transfer (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (3 papers)
- Partner nations
- United StatesJapan
In The Last Decade
Robert E. Simons
32 papers receiving 889 citations
Peers
Comparison fields: 5 of 58
- Mechanical Engineering 665
- Hardware and Architecture 81
- Computational Mechanics 115
- Electrical and Electronic Engineering 273
- Materials Chemistry 217
Countries citing papers authored by Robert E. Simons
This map shows the geographic impact of Robert E. Simons's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert E. Simons with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert E. Simons more than expected).
Fields of papers citing papers by Robert E. Simons
This network shows the impact of papers produced by Robert E. Simons. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert E. Simons. The network helps show where Robert E. Simons may publish in the future.
Co-authors
The 15 scholars most cited alongside Robert E. Simons, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 196 | |
| 2 | 1982 | 88 | |
| 3 | 2012 | 85 | |
| 4 | 2002 | 83 | |
| 5 | 2005 | 63 | |
| 6 | 1993 | 63 | |
| 7 | 2008 | 51 | |
| 8 | 2012 | 45 | |
| 9 | 1997 | 29 | |
| 10 | 1995 | 24 | |
| 11 | 2003 | 23 | |
| 12 | 2002 | 22 | |
| 13 | 1995 | 22 | |
| 14 | 2012 | 20 | |
| 15 | 1989 | 19 | |
| 16 | 1995 | 18 | |
| 17 | 1985 | 17 | |
| 18 | 2003 | 14 | |
| 19 | 2012 | 14 | |
| 20 | 1994 | 11 |
About Robert E. Simons
Robert E. Simons is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Materials Chemistry, Computer Networks and Communications and Information Systems, having authored 34 papers that have together received 959 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (30 papers), Heat Transfer and Boiling Studies (11 papers), Heat Transfer Mechanisms (9 papers), Electronic Packaging and Soldering Technologies (6 papers), Advanced Thermoelectric Materials and Devices (6 papers), 3D IC and TSV technologies (5 papers), Cloud Computing and Resource Management (3 papers) and Parallel Computing and Optimization Techniques (3 papers). The work is most often cited by research in Mechanical Engineering (665 citations), Hardware and Architecture (81 citations), Computational Mechanics (115 citations), Electrical and Electronic Engineering (273 citations) and Materials Chemistry (217 citations). Robert E. Simons has collaborated with scholars based in United States and Japan. Frequent co-authors include Richard C. Chu, Michael Ellsworth, Roger Schmidt, Vincent W. Antonetti, G. Chrysler, Madhusudan Iyengar, Mark Schultz, Pritish R. Parida, Timothy Chainer and Michael Gaynes. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Electronic Packaging, IBM Journal of Research and Development, Journal of Heat Transfer and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.