D. Ney
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
Papers in
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- Semiconductor materials and devices 25
- Electronic Packaging and Soldering Technologies 17
- Integrated Circuits and Semiconductor Failure Analysis 7
- Advancements in Semiconductor Devices and Circuit Design 5
- 3D IC and TSV technologies 2
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- Copper Interconnects and Reliability 23
- Co-authors
- X. Federspiel (14 shared papers)Ο. Thomas (4 shared papers)Patrice Gergaud (4 shared papers)Laurent Doyen (5 shared papers)L. Arnaud (8 shared papers)Y. Wouters (8 shared papers)F. Cacho (3 shared papers)E. Petitprez (5 shared papers)
- Journals
- Microelectronics Reliability (3 papers)Microelectronic Engineering (2 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Journal of the National Medical Association (1 paper)IEEE Transactions on Applied Superconductivity (1 paper)
- Partner nations
- FranceSwitzerlandNetherlands
In The Last Decade
D. Ney
31 papers receiving 151 citations
Peers
Comparison fields: 5 of 27
- Electronic, Optical and Magnetic Materials 84
- Electrical and Electronic Engineering 145
- Hardware and Architecture 14
- Atomic and Molecular Physics, and Optics 20
- Instrumentation 2
Countries citing papers authored by D. Ney
This map shows the geographic impact of D. Ney's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Ney with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Ney more than expected).
Fields of papers citing papers by D. Ney
This network shows the impact of papers produced by D. Ney. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Ney. The network helps show where D. Ney may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Ney, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 28 | |
| 2 | 2006 | 21 | |
| 3 | 2005 | 19 | |
| 4 | 2020 | 7 | |
| 5 | 2006 | 7 | |
| 6 | 2003 | 6 | |
| 7 | 2011 | 6 | |
| 8 | 2010 | 6 | |
| 9 | 2005 | 6 | |
| 10 | 2022 | 4 | |
| 11 | 2001 | 4 | |
| 12 | 2005 | 4 | |
| 13 | 2007 | 3 | |
| 14 | 2005 | 3 | |
| 15 | 2011 | 3 | |
| 16 | 2014 | 3 | |
| 17 | 2012 | 3 | |
| 18 | 2017 | 3 | |
| 19 | 2013 | 3 | |
| 20 | 2022 | 2 |
About D. Ney
D. Ney is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Pharmacology and Condensed Matter Physics, having authored 34 papers that have together received 156 indexed citations. Recurring topics across this work include Semiconductor materials and devices (25 papers), Copper Interconnects and Reliability (23 papers), Electronic Packaging and Soldering Technologies (17 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Semiconductor materials and interfaces (5 papers), 3D IC and TSV technologies (2 papers) and Pharmaceutical Practices and Patient Outcomes (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (84 citations), Electrical and Electronic Engineering (145 citations), Hardware and Architecture (14 citations), Atomic and Molecular Physics, and Optics (20 citations) and Instrumentation (2 citations). D. Ney has collaborated with scholars based in France, Switzerland and Netherlands. Frequent co-authors include X. Federspiel, Ο. Thomas, Patrice Gergaud, Laurent Doyen, L. Arnaud, Y. Wouters, F. Cacho, E. Petitprez, J.C. Dupuy and N. Casanova. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, IEEE Transactions on Device and Materials Reliability, Journal of the National Medical Association and IEEE Transactions on Applied Superconductivity.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.