Mei-Ling Wu
Impact in
- Mechanics of Materials top 10%
- Metal and Thin Film Mechanics
- Ultrasonics and Acoustic Wave Propagation
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Silicon Carbide Semiconductor Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 36
- 3D IC and TSV technologies 27
-
- Mechanical Behavior of Composites 5
- Material Properties and Processing 4
- Co-authors
- Lien-Wen Chen (2 shared papers)Liang-Yu Wu (4 shared papers)William D. Sproul (3 shared papers)Yip-Wah Chung (1 shared paper)Vinayak P. Dravid (1 shared paper)Yip‐Wah Chung (1 shared paper)Lien-Wen Chen (3 shared papers)Yusin Lee (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)Microelectronics Reliability (3 papers)Smart Materials and Structures (2 papers)Physica B Condensed Matter (1 paper)Transportation Research Part B Methodological (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Mei-Ling Wu
50 papers receiving 479 citations
Peers
Comparison fields: 5 of 64
- Mechanics of Materials 184
- Electrical and Electronic Engineering 215
- Biomedical Engineering 159
- Speech and Hearing 17
- Industrial and Manufacturing Engineering 30
Countries citing papers authored by Mei-Ling Wu
This map shows the geographic impact of Mei-Ling Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mei-Ling Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mei-Ling Wu more than expected).
Fields of papers citing papers by Mei-Ling Wu
This network shows the impact of papers produced by Mei-Ling Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mei-Ling Wu. The network helps show where Mei-Ling Wu may publish in the future.
Co-authors
The 25 scholars most cited alongside Mei-Ling Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 57 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 69 | |
| 2 | 2008 | 64 | |
| 3 | 1997 | 38 | |
| 4 | 1997 | 37 | |
| 5 | 2018 | 32 | |
| 6 | 2017 | 31 | |
| 7 | 2009 | 28 | |
| 8 | 2013 | 27 | |
| 9 | 2016 | 21 | |
| 10 | 1998 | 12 | |
| 11 | 2009 | 12 | |
| 12 | 2012 | 9 | |
| 13 | 2008 | 9 | |
| 14 | 2009 | 8 | |
| 15 | Perceptions of work engagement of nurses in Taiwan | 2010 | 7 |
| 16 | 2017 | 6 | |
| 17 | 2021 | 6 | |
| 18 | 2009 | 6 | |
| 19 | 2014 | 6 | |
| 20 | 2018 | 5 |
About Mei-Ling Wu
Mei-Ling Wu is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Automotive Engineering, having authored 57 papers that have together received 498 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (27 papers), Metal Forming Simulation Techniques (9 papers), Mechanical Behavior of Composites (5 papers), Advanced Surface Polishing Techniques (5 papers), Acoustic Wave Phenomena Research (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers) and Material Properties and Processing (4 papers). The work is most often cited by research in Mechanics of Materials (184 citations), Electrical and Electronic Engineering (215 citations), Biomedical Engineering (159 citations), Speech and Hearing (17 citations) and Industrial and Manufacturing Engineering (30 citations). Mei-Ling Wu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Lien-Wen Chen, Liang-Yu Wu, William D. Sproul, Yip-Wah Chung, Vinayak P. Dravid, Yip‐Wah Chung, Lien-Wen Chen, Yusin Lee, Dung‐Ying Lin and Donald E. Barker. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Smart Materials and Structures, Physica B Condensed Matter and Transportation Research Part B Methodological.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.