Chih‐Ming Chen
About
Chih‐Ming Chen has authored 227 papers that have received a total of 3.8k indexed citations.
This includes 126 papers in Electrical and Electronic Engineering, 55 papers in Materials Chemistry and 51 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (97 papers), 3D IC and TSV technologies (48 papers) and Copper Interconnects and Reliability (36 papers). Chih‐Ming Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (97 papers), 3D IC and TSV technologies (48 papers) and Copper Interconnects and Reliability (36 papers) and collaborates with scholars based in Taiwan, Hong Kong and United States. Chih‐Ming Chen's co-authors include Sinn-wen Chen, Hsuan Lee, Shien‐Ping Feng, Tzu‐Chien Wei and Ching Hsuan Lin and has published in prestigious journals such as Journal of Biological Chemistry, Journal of Applied Physics and Analytical Biochemistry.
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Vratislav Langer Top fields papers by Koji Fushimi are about Top journals papers by Tao Wang are published in Top journals papers by Yunjie Liu are published in Top fields papers by Byoung Ryong Jeong are about Top fields papers by Timothy D. Wilkinson are about Top authors papers by Antônio A. F. Loureiro are co-authored with Top countries impacted by papers by Regina Guenka Palma‐Dibb