Chih‐Ming Chen
Impact in
- General Materials Science top 0.2%
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
Papers in
-
- Electronic Packaging and Soldering Technologies 107
- 3D IC and TSV technologies 55
- Electrodeposition and Electroless Coatings 30
- Co-authors
- Sinn-wen Chen (19 shared papers)Hsuan Lee (15 shared papers)Manik Chandra Sil (18 shared papers)Tzu‐Chien Wei (12 shared papers)Shien‐Ping Feng (14 shared papers)Wei‐Ping Dow (7 shared papers)Chi-Yu Huang (1 shared paper)Yu‐Der Lee (1 shared paper)
- Journals
- Journal of Electronic Materials (33 papers)Journal of Alloys and Compounds (16 papers)Journal of The Electrochemical Society (10 papers)Metallurgical and Materials Transactions A (8 papers)Microelectronics Reliability (7 papers)
- Partner nations
- TaiwanHong KongUnited States
In The Last Decade
Chih‐Ming Chen
247 papers receiving 4.6k citations
Peers
Comparison fields: 5 of 143
- General Materials Science 215
- Electrical and Electronic Engineering 2.6k
- Molecular Medicine 203
- Renewable Energy, Sustainability and the Environment 657
- Electronic, Optical and Magnetic Materials 682
Countries citing papers authored by Chih‐Ming Chen
This map shows the geographic impact of Chih‐Ming Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chih‐Ming Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chih‐Ming Chen more than expected).
Fields of papers citing papers by Chih‐Ming Chen
This network shows the impact of papers produced by Chih‐Ming Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chih‐Ming Chen. The network helps show where Chih‐Ming Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Chih‐Ming Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 259 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1998 | 184 | |
| 2 | 1999 | 161 | |
| 3 | 2002 | 118 | |
| 4 | 2007 | 111 | |
| 5 | 1999 | 99 | |
| 6 | 2007 | 96 | |
| 7 | 2006 | 81 | |
| 8 | 2001 | 78 | |
| 9 | 2009 | 75 | |
| 10 | 1998 | 72 | |
| 11 | 2005 | 70 | |
| 12 | 2007 | 62 | |
| 13 | 2017 | 58 | |
| 14 | 2011 | 57 | |
| 15 | 2018 | 55 | |
| 16 | 2010 | 52 | |
| 17 | 2001 | 50 | |
| 18 | 2007 | 48 | |
| 19 | 2000 | 46 | |
| 20 | 2020 | 45 |
About Chih‐Ming Chen
Chih‐Ming Chen is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering, Renewable Energy, Sustainability and the Environment and Electronic, Optical and Magnetic Materials, having authored 259 papers that have together received 4.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (107 papers), 3D IC and TSV technologies (55 papers), Copper Interconnects and Reliability (39 papers), TiO2 Photocatalysis and Solar Cells (34 papers), Advanced Photocatalysis Techniques (32 papers), Electrodeposition and Electroless Coatings (30 papers), Intermetallics and Advanced Alloy Properties (29 papers) and Semiconductor materials and interfaces (18 papers). The work is most often cited by research in General Materials Science (215 citations), Electrical and Electronic Engineering (2.6k citations), Molecular Medicine (203 citations), Renewable Energy, Sustainability and the Environment (657 citations) and Electronic, Optical and Magnetic Materials (682 citations). Chih‐Ming Chen has collaborated with scholars based in Taiwan, Hong Kong and United States. Frequent co-authors include Sinn-wen Chen, Hsuan Lee, Manik Chandra Sil, Tzu‐Chien Wei, Shien‐Ping Feng, Wei‐Ping Dow, Chi-Yu Huang, Yu‐Der Lee, Cheng‐Chung Chang and Ray‐Hua Horng. Their work appears in journals such as Journal of Electronic Materials, Journal of Alloys and Compounds, Journal of The Electrochemical Society, Metallurgical and Materials Transactions A and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.