Chih‐Ming Chen

230 papers and 3.9k indexed citations i.

About

Chih‐Ming Chen has authored 230 papers that have received a total of 3.9k indexed citations. This includes 128 papers in Electrical and Electronic Engineering, 56 papers in Materials Chemistry and 53 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (99 papers), 3D IC and TSV technologies (49 papers) and Copper Interconnects and Reliability (36 papers). Chih‐Ming Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (99 papers), 3D IC and TSV technologies (49 papers) and Copper Interconnects and Reliability (36 papers) and collaborates with scholars based in Taiwan, Hong Kong and United States. Chih‐Ming Chen's co-authors include Sinn-wen Chen, Hsuan Lee, Shien‐Ping Feng, Tzu‐Chien Wei and Ching Hsuan Lin and has published in prestigious journals such as Journal of Biological Chemistry, Journal of Applied Physics and Analytical Biochemistry.

In The Last Decade

Fields of papers published by Chih‐Ming Chen

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Chih‐Ming Chen

Since Specialization
Citations
Rankless by CCL
2025