Bumhee Bae
Impact in
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- Wireless Power Transfer Systems
- Energy Harvesting in Wireless Networks
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Measurements
- Media Technology top 10%
- RFID technology advancements
Papers in
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- Electromagnetic Compatibility and Noise Suppression 22
- Wireless Power Transfer Systems 13
- Energy Harvesting in Wireless Networks 13
- 3D IC and TSV technologies 12
- Electrostatic Discharge in Electronics 5
- Electronic Packaging and Soldering Technologies 5
- Microwave Engineering and Waveguides 4
- Integrated Circuits and Semiconductor Failure Analysis 4
- Co-authors
- Joungho Kim (27 shared papers)Jonghoon J. Kim (16 shared papers)Sunkyu Kong (15 shared papers)Sukjin Kim (15 shared papers)D. Jung (10 shared papers)Madhavan Swaminathan (1 shared paper)Jonghoon Kim (8 shared papers)Kyoungchoul Koo (3 shared papers)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (6 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)Electronics (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)
- Partner nations
- South KoreaUnited StatesItaly
In The Last Decade
Bumhee Bae
40 papers receiving 464 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 448
- Media Technology 42
- Automotive Engineering 47
- Hardware and Architecture 19
- Aerospace Engineering 52
Countries citing papers authored by Bumhee Bae
This map shows the geographic impact of Bumhee Bae's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bumhee Bae with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bumhee Bae more than expected).
Fields of papers citing papers by Bumhee Bae
This network shows the impact of papers produced by Bumhee Bae. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bumhee Bae. The network helps show where Bumhee Bae may publish in the future.
Co-authors
The 25 scholars most cited alongside Bumhee Bae, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 64 | |
| 2 | 2015 | 49 | |
| 3 | 2011 | 44 | |
| 4 | 2014 | 33 | |
| 5 | 2015 | 29 | |
| 6 | 2013 | 26 | |
| 7 | 2017 | 23 | |
| 8 | 2017 | 17 | |
| 9 | 2016 | 16 | |
| 10 | 2014 | 14 | |
| 11 | 2017 | 14 | |
| 12 | 2018 | 13 | |
| 13 | 2015 | 12 | |
| 14 | 2013 | 12 | |
| 15 | 2015 | 11 | |
| 16 | 2013 | 11 | |
| 17 | 2017 | 8 | |
| 18 | 2014 | 7 | |
| 19 | 2018 | 7 | |
| 20 | 2018 | 6 |
About Bumhee Bae
Bumhee Bae is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Media Technology, Aerospace Engineering and Biomedical Engineering, having authored 43 papers that have together received 477 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (22 papers), Wireless Power Transfer Systems (13 papers), Energy Harvesting in Wireless Networks (13 papers), 3D IC and TSV technologies (12 papers), Electrostatic Discharge in Electronics (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Microwave Engineering and Waveguides (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (448 citations), Media Technology (42 citations), Automotive Engineering (47 citations), Hardware and Architecture (19 citations) and Aerospace Engineering (52 citations). Bumhee Bae has collaborated with scholars based in South Korea, United States and Italy. Frequent co-authors include Joungho Kim, Jonghoon J. Kim, Sunkyu Kong, Sukjin Kim, D. Jung, Madhavan Swaminathan, Jonghoon Kim, Kyoungchoul Koo, Seungyoung Ahn and Chulsoon Hwang. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Electronics and IEEE Microwave and Wireless Components Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.