Ying-Lang Wang
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Advanced Memory and Neural Computing
- Electrodeposition and Electroless Coatings
- Electronic Packaging and Soldering Technologies
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Semiconductor materials and devices 35
- Electrodeposition and Electroless Coatings 21
- Electronic Packaging and Soldering Technologies 14
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- Copper Interconnects and Reliability 42
- Co-authors
- Shih-Chieh Chang (24 shared papers)Wen-Hsi Lee (19 shared papers)Ting‐Chang Chang (4 shared papers)Kuan‐Chang Chang (3 shared papers)Tsung‐Ming Tsai (3 shared papers)Yong-En Syu (3 shared papers)Tzeng‐Feng Liu (5 shared papers)Simon M. Sze (3 shared papers)
- Journals
- Journal of The Electrochemical Society (10 papers)Japanese Journal of Applied Physics (8 papers)Thin Solid Films (5 papers)Journal of Physics and Chemistry of Solids (5 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (4 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Ying-Lang Wang
73 papers receiving 726 citations
Peers
Comparison fields: 5 of 48
- Electronic, Optical and Magnetic Materials 210
- Electrical and Electronic Engineering 651
- Electrochemistry 33
- Polymers and Plastics 74
- Materials Chemistry 225
Countries citing papers authored by Ying-Lang Wang
This map shows the geographic impact of Ying-Lang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ying-Lang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ying-Lang Wang more than expected).
Fields of papers citing papers by Ying-Lang Wang
This network shows the impact of papers produced by Ying-Lang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ying-Lang Wang. The network helps show where Ying-Lang Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Ying-Lang Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 79 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 97 | |
| 2 | 2015 | 42 | |
| 3 | 2014 | 41 | |
| 4 | 2012 | 30 | |
| 5 | 2003 | 28 | |
| 6 | 2005 | 26 | |
| 7 | 2010 | 22 | |
| 8 | 2012 | 19 | |
| 9 | 2016 | 18 | |
| 10 | 2007 | 18 | |
| 11 | 2004 | 17 | |
| 12 | 2000 | 16 | |
| 13 | 2010 | 16 | |
| 14 | 2013 | 14 | |
| 15 | 2011 | 14 | |
| 16 | 2004 | 14 | |
| 17 | 2008 | 14 | |
| 18 | 2011 | 14 | |
| 19 | 2007 | 14 | |
| 20 | 2005 | 13 |
About Ying-Lang Wang
Ying-Lang Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Materials Chemistry, having authored 79 papers that have together received 754 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (35 papers), Electrodeposition and Electroless Coatings (21 papers), Advanced Surface Polishing Techniques (17 papers), Metal and Thin Film Mechanics (16 papers), Electronic Packaging and Soldering Technologies (14 papers), Semiconductor materials and interfaces (10 papers) and Corrosion Behavior and Inhibition (8 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (210 citations), Electrical and Electronic Engineering (651 citations), Electrochemistry (33 citations), Polymers and Plastics (74 citations) and Materials Chemistry (225 citations). Ying-Lang Wang has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Shih-Chieh Chang, Wen-Hsi Lee, Ting‐Chang Chang, Kuan‐Chang Chang, Tsung‐Ming Tsai, Yong-En Syu, Tzeng‐Feng Liu, Simon M. Sze, Ming‐Jinn Tsai and Yi-Lung Cheng. Their work appears in journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics, Thin Solid Films, Journal of Physics and Chemistry of Solids and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.