Hsuan Lee

30 papers and 595 indexed citations i.

Hsuan Lee has authored 30 papers that have received a total of 595 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 8 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), Electrodeposition and Electroless Coatings (10 papers) and Copper Interconnects and Reliability (8 papers). Hsuan Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), Electrodeposition and Electroless Coatings (10 papers) and Copper Interconnects and Reliability (8 papers) and collaborates with scholars based in Taiwan, Japan and Hong Kong. Hsuan Lee's co-authors include Chih‐Ming Chen, Shi‐Wei Chu, Wei‐Ping Dow, Yen-Ta Huang and Katsumasa Fujita and has published in prestigious journals such as Physical Review Letters, The Journal of Chemical Physics and Journal of The Electrochemical Society.