Wangyun Li
Impact in
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Metal Forming Simulation Techniques
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 52
- 3D IC and TSV technologies 26
-
- Aluminum Alloys Composites Properties 24
- Advanced Welding Techniques Analysis 15
- Metal Forming Simulation Techniques 8
- Intermetallics and Advanced Alloy Properties 6
- Co-authors
- Hongbo Qin (19 shared papers)Bo Wang (6 shared papers)X.P. Zhang (2 shared papers)Min-Bo Zhou (6 shared papers)Xin‐Ping Zhang (7 shared papers)H. Qin (3 shared papers)Shuye Zhang (1 shared paper)Katsuaki Suganuma (4 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (8 papers)Microelectronics Reliability (5 papers)Journal of Materials Research and Technology (3 papers)Journal of Materials Science (3 papers)Vacuum (2 papers)
- Partner nations
- ChinaJapanNetherlands
In The Last Decade
Wangyun Li
55 papers receiving 309 citations
Peers
Comparison fields: 5 of 25
- Mechanical Engineering 200
- Electrical and Electronic Engineering 265
- Ceramics and Composites 18
- General Materials Science 7
- Materials Chemistry 73
Countries citing papers authored by Wangyun Li
This map shows the geographic impact of Wangyun Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wangyun Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wangyun Li more than expected).
Fields of papers citing papers by Wangyun Li
This network shows the impact of papers produced by Wangyun Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wangyun Li. The network helps show where Wangyun Li may publish in the future.
Co-authors
The 25 scholars most cited alongside Wangyun Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 62 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 28 | |
| 2 | 2022 | 26 | |
| 3 | 2014 | 25 | |
| 4 | 2023 | 21 | |
| 5 | 2017 | 19 | |
| 6 | 2016 | 13 | |
| 7 | 2020 | 13 | |
| 8 | 2023 | 9 | |
| 9 | 2022 | 7 | |
| 10 | 2022 | 7 | |
| 11 | 2023 | 7 | |
| 12 | 2022 | 7 | |
| 13 | 2024 | 6 | |
| 14 | 2023 | 6 | |
| 15 | 2015 | 6 | |
| 16 | 2016 | 6 | |
| 17 | 2018 | 6 | |
| 18 | 2022 | 6 | |
| 19 | 2022 | 6 | |
| 20 | 2024 | 5 |
About Wangyun Li
Wangyun Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 62 papers that have together received 317 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (26 papers), Aluminum Alloys Composites Properties (24 papers), Advanced Welding Techniques Analysis (15 papers), Microstructure and mechanical properties (13 papers), Metal Forming Simulation Techniques (8 papers), Intermetallics and Advanced Alloy Properties (6 papers) and Copper Interconnects and Reliability (4 papers). The work is most often cited by research in Mechanical Engineering (200 citations), Electrical and Electronic Engineering (265 citations), Ceramics and Composites (18 citations), General Materials Science (7 citations) and Materials Chemistry (73 citations). Wangyun Li has collaborated with scholars based in China, Japan and Netherlands. Frequent co-authors include Hongbo Qin, Bo Wang, X.P. Zhang, Min-Bo Zhou, Xin‐Ping Zhang, H. Qin, Shuye Zhang, Katsuaki Suganuma, Siliang He and Chuantong Chen. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Microelectronics Reliability, Journal of Materials Research and Technology, Journal of Materials Science and Vacuum.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.