Andreas Schletz
Impact in
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- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Advanced DC-DC Converters
Papers in
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- Electronic Packaging and Soldering Technologies 27
- Silicon Carbide Semiconductor Technologies 19
- 3D IC and TSV technologies 16
- Electromagnetic Compatibility and Noise Suppression 8
- Electrostatic Discharge in Electronics 5
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- Aluminum Alloys Composites Properties 8
- Co-authors
- W. Wondrak (3 shared papers)L. Frey (4 shared papers)Martin März (10 shared papers)R. T. Schneider (2 shared papers)Nguyễn Thị Thắm (1 shared paper)Bernd Eckardt (2 shared papers)Xingfu Tang (1 shared paper)Markus Rauch (2 shared papers)
- Journals
- Microelectronics Reliability (10 papers)IEEE Transactions on Dielectrics and Electrical Insulation (1 paper)Materials science forum (2 papers)Journal of Microelectronics and Electronic Packaging (1 paper)Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (17 papers)
- Partner nations
- GermanyJapanSwitzerland
In The Last Decade
Andreas Schletz
45 papers receiving 562 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 516
- Ceramics and Composites 36
- Mechanical Engineering 189
- Materials Chemistry 142
- Automotive Engineering 26
Countries citing papers authored by Andreas Schletz
This map shows the geographic impact of Andreas Schletz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andreas Schletz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andreas Schletz more than expected).
Fields of papers citing papers by Andreas Schletz
This network shows the impact of papers produced by Andreas Schletz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andreas Schletz. The network helps show where Andreas Schletz may publish in the future.
Co-authors
The 25 scholars most cited alongside Andreas Schletz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 138 | |
| 2 | 2015 | 81 | |
| 3 | Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliability | 2010 | 53 |
| 4 | 2010 | 29 | |
| 5 | 2016 | 18 | |
| 6 | 2016 | 16 | |
| 7 | 2014 | 15 | |
| 8 | 2022 | 15 | |
| 9 | 2015 | 14 | |
| 10 | 2016 | 13 | |
| 11 | Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation | 2016 | 13 |
| 12 | 2014 | 13 | |
| 13 | 2016 | 11 | |
| 14 | Reliability of insulating substrates — High temperature power electronics for more electric aircraft | 2011 | 11 |
| 15 | 2020 | 11 | |
| 16 | Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength | 2016 | 11 |
| 17 | 2013 | 10 | |
| 18 | 2014 | 9 | |
| 19 | 2016 | 9 | |
| 20 | 2019 | 8 |
About Andreas Schletz
Andreas Schletz is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Ceramics and Composites, having authored 47 papers that have together received 579 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), Silicon Carbide Semiconductor Technologies (19 papers), 3D IC and TSV technologies (16 papers), Aluminum Alloys Composites Properties (8 papers), Electromagnetic Compatibility and Noise Suppression (8 papers), High voltage insulation and dielectric phenomena (7 papers), Electrostatic Discharge in Electronics (5 papers) and Copper Interconnects and Reliability (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (516 citations), Ceramics and Composites (36 citations), Mechanical Engineering (189 citations), Materials Chemistry (142 citations) and Automotive Engineering (26 citations). Andreas Schletz has collaborated with scholars based in Germany, Japan and Switzerland. Frequent co-authors include W. Wondrak, L. Frey, Martin März, R. T. Schneider, Nguyễn Thị Thắm, Bernd Eckardt, Xingfu Tang, Markus Rauch, Francesco Iannuzzo and Christian Lenz. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Dielectrics and Electrical Insulation, Materials science forum, Journal of Microelectronics and Electronic Packaging and Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.