Daoguo Yang
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Gas Sensing Nanomaterials and Sensors
- Materials Chemistry top 5%
- 2D Materials and Applications
- Graphene research and applications
- Thermal properties of materials
- MXene and MAX Phase Materials
Papers in
-
- Electronic Packaging and Soldering Technologies 85
- 3D IC and TSV technologies 44
-
- Epoxy Resin Curing Processes 17
- Co-authors
- Ping Zhang (21 shared papers)Xianping Chen (24 shared papers)Y.C. Chan (3 shared papers)Tian‐Ling Ren (6 shared papers)Ning Yang (9 shared papers)Peng Yuan (7 shared papers)Miao Cai (68 shared papers)Guoqi Zhang (28 shared papers)
- Journals
- Microelectronics Reliability (17 papers)Materials (5 papers)Applied Thermal Engineering (4 papers)IEEE Transactions on Device and Materials Reliability (3 papers)Scientific Reports (3 papers)
- Partner nations
- ChinaNetherlandsUnited States
In The Last Decade
Daoguo Yang
213 papers receiving 3.8k citations
Daoguo Yang's Hit Papers
Peers
Comparison fields: 5 of 123
- Electrical and Electronic Engineering 1.9k
- Materials Chemistry 1.5k
- Condensed Matter Physics 344
- Bioengineering 154
- Polymers and Plastics 294
Countries citing papers authored by Daoguo Yang
This map shows the geographic impact of Daoguo Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daoguo Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daoguo Yang more than expected).
Fields of papers citing papers by Daoguo Yang
This network shows the impact of papers produced by Daoguo Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daoguo Yang. The network helps show where Daoguo Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside Daoguo Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 224 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Carbon nanotube based biosensors Hit paper breakdown → | 2014 | 469 |
| 2 | 2010 | 238 | |
| 3 | 2020 | 174 | |
| 4 | 2017 | 136 | |
| 5 | 2017 | 122 | |
| 6 | 2016 | 116 | |
| 7 | 2021 | 96 | |
| 8 | 2017 | 85 | |
| 9 | 2016 | 75 | |
| 10 | 2015 | 74 | |
| 11 | 2015 | 70 | |
| 12 | 2017 | 69 | |
| 13 | 2018 | 68 | |
| 14 | 2018 | 64 | |
| 15 | 2015 | 55 | |
| 16 | 2018 | 50 | |
| 17 | 2015 | 50 | |
| 18 | 2003 | 47 | |
| 19 | 2016 | 47 | |
| 20 | 2016 | 47 |
About Daoguo Yang
Daoguo Yang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Materials Chemistry and Condensed Matter Physics, having authored 224 papers that have together received 3.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (85 papers), 3D IC and TSV technologies (44 papers), GaN-based semiconductor devices and materials (33 papers), Mechanical Behavior of Composites (30 papers), Engineering Applied Research (18 papers), Epoxy Resin Curing Processes (17 papers), 2D Materials and Applications (16 papers) and Graphene research and applications (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.9k citations), Materials Chemistry (1.5k citations), Condensed Matter Physics (344 citations), Bioengineering (154 citations) and Polymers and Plastics (294 citations). Daoguo Yang has collaborated with scholars based in China, Netherlands and United States. Frequent co-authors include Ping Zhang, Xianping Chen, Y.C. Chan, Tian‐Ling Ren, Ning Yang, Peng Yuan, Miao Cai, Guoqi Zhang, Siping Zhai and Hongbo Qin. Their work appears in journals such as Microelectronics Reliability, Materials, Applied Thermal Engineering, IEEE Transactions on Device and Materials Reliability and Scientific Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.