Siliang He
About
Siliang He has authored 39 papers that have received a total of 328 indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloys Composites Properties (10 papers). Siliang He is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloys Composites Properties (10 papers) and collaborates with scholars based in Japan, China and Taiwan. Siliang He's co-authors include Hiroshi Nishikawa, Yu-An Shen, Jiahui Li, Jinguo Ge and Chuan Hu and has published in prestigious journals such as Journal of Applied Physics, Scientific Reports and Materials Science and Engineering A.
In The Last Decade
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