Hiroshi Nishikawa

492 papers and 8.0k indexed citations i.

Hiroshi Nishikawa has authored 492 papers that have received a total of 8.0k indexed citations. This includes 218 papers in Mechanical Engineering, 188 papers in Electrical and Electronic Engineering and 59 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (168 papers), 3D IC and TSV technologies (105 papers) and Aluminum Alloys Composites Properties (48 papers). Hiroshi Nishikawa is often cited by papers focused on Electronic Packaging and Soldering Technologies (168 papers), 3D IC and TSV technologies (105 papers) and Aluminum Alloys Composites Properties (48 papers) and collaborates with scholars based in Japan, United Kingdom and China. Hiroshi Nishikawa's co-authors include M. Kaneta, Tadashi Takemoto, Yu-An Shen, Satoshi Honjo and Isao Todoroki and has published in prestigious journals such as Journal of Applied Physics, PLoS ONE and Cancer Research.