Daniel Dreps
Impact in
- Hardware and Architecture top 5%
- Parallel Computing and Optimization Techniques
- VLSI and Analog Circuit Testing
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- Advancements in PLL and VCO Technologies
- Radio Frequency Integrated Circuit Design
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
Papers in
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- Electromagnetic Compatibility and Noise Suppression 24
- Advancements in PLL and VCO Technologies 19
- 3D IC and TSV technologies 15
- Radio Frequency Integrated Circuit Design 11
- Electronic Packaging and Soldering Technologies 9
- Semiconductor Lasers and Optical Devices 7
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- VLSI and Analog Circuit Testing 11
- Co-authors
- Jose A. Hejase (20 shared papers)Thomas Toifl (3 shared papers)R. Reutemann (3 shared papers)Michael Ruegg (3 shared papers)Kyu Hyun Kim (4 shared papers)Dale Becker (16 shared papers)Daniel J. Friedman (2 shared papers)Seongwon Kim (2 shared papers)
- Journals
- IBM Journal of Research and Development (5 papers)IEEE Journal of Solid-State Circuits (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Journal of Electrostatics (1 paper)Electrical Performance of Electronic Packaging (3 papers)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
Daniel Dreps
51 papers receiving 375 citations
Peers
Comparison fields: 5 of 38
- Hardware and Architecture 144
- Electrical and Electronic Engineering 324
- Computer Networks and Communications 106
- Nuclear Energy and Engineering 1
- Computational Mathematics 1
Countries citing papers authored by Daniel Dreps
This map shows the geographic impact of Daniel Dreps's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Dreps with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Dreps more than expected).
Fields of papers citing papers by Daniel Dreps
This network shows the impact of papers produced by Daniel Dreps. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Dreps. The network helps show where Daniel Dreps may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel Dreps, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 56 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 54 | |
| 2 | 2014 | 39 | |
| 3 | 2018 | 36 | |
| 4 | 2008 | 27 | |
| 5 | 2010 | 25 | |
| 6 | 2017 | 18 | |
| 7 | 2017 | 15 | |
| 8 | 2018 | 14 | |
| 9 | 2014 | 11 | |
| 10 | 2009 | 10 | |
| 11 | 2013 | 9 | |
| 12 | 2002 | 9 | |
| 13 | 2022 | 9 | |
| 14 | 2017 | 8 | |
| 15 | 2008 | 7 | |
| 16 | 2009 | 7 | |
| 17 | 2010 | 7 | |
| 18 | 2002 | 6 | |
| 19 | 2008 | 6 | |
| 20 | 2007 | 6 |
About Daniel Dreps
Daniel Dreps is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Biomedical Engineering and Computational Theory and Mathematics, having authored 56 papers that have together received 406 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (24 papers), Advancements in PLL and VCO Technologies (19 papers), 3D IC and TSV technologies (15 papers), VLSI and Analog Circuit Testing (11 papers), Radio Frequency Integrated Circuit Design (11 papers), Interconnection Networks and Systems (9 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor Lasers and Optical Devices (7 papers). The work is most often cited by research in Hardware and Architecture (144 citations), Electrical and Electronic Engineering (324 citations), Computer Networks and Communications (106 citations), Nuclear Energy and Engineering (1 citation) and Computational Mathematics (1 citation). Daniel Dreps has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include Jose A. Hejase, Thomas Toifl, R. Reutemann, Michael Ruegg, Kyu Hyun Kim, Dale Becker, Daniel J. Friedman, Seongwon Kim, S.V. Rylov and P. Coteus. Their work appears in journals such as IBM Journal of Research and Development, IEEE Journal of Solid-State Circuits, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electrostatics and Electrical Performance of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.