J.P. Libous
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Low-power high-performance VLSI design
- VLSI and FPGA Design Techniques
- Electronic Packaging and Soldering Technologies
- Power Line Communications and Noise
- Hardware and Architecture top 10%
Papers in
-
- Electromagnetic Compatibility and Noise Suppression 12
- 3D IC and TSV technologies 7
- Electrostatic Discharge in Electronics 7
- Electromagnetic Compatibility and Measurements 3
- Electronic Packaging and Soldering Technologies 2
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- Control Systems and Identification 3
- Co-authors
- Madhavan Swaminathan (7 shared papers)István Novák (1 shared paper)Joungho Kim (1 shared paper)Bhyrav Mutnury (3 shared papers)Daniel O’Connor (7 shared papers)Jean Audet (2 shared papers)Suna Choi (1 shared paper)Lara B. Eisenberg (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)Electrical Performance of Electronic Packaging (1 paper)
- Partner nations
- United StatesSouth KoreaCanada
In The Last Decade
J.P. Libous
15 papers receiving 361 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 366
- Hardware and Architecture 45
- Computational Mathematics 2
- Aerospace Engineering 65
- Electronic, Optical and Magnetic Materials 22
Countries citing papers authored by J.P. Libous
This map shows the geographic impact of J.P. Libous's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.P. Libous with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.P. Libous more than expected).
Fields of papers citing papers by J.P. Libous
This network shows the impact of papers produced by J.P. Libous. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.P. Libous. The network helps show where J.P. Libous may publish in the future.
Co-authors
The 12 scholars most cited alongside J.P. Libous, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 208 | |
| 2 | 2006 | 63 | |
| 3 | 1997 | 36 | |
| 4 | 2003 | 19 | |
| 5 | 2002 | 8 | |
| 6 | 2003 | 7 | |
| 7 | 2004 | 6 | |
| 8 | 2002 | 6 | |
| 9 | 2004 | 6 | |
| 10 | 2002 | 6 | |
| 11 | 2002 | 6 | |
| 12 | 2003 | 3 | |
| 13 | 2007 | 3 | |
| 14 | 2002 | 2 | |
| 15 | 2002 | 1 |
About J.P. Libous
J.P. Libous is a scholar working on Electrical and Electronic Engineering, Control and Systems Engineering, Computer Networks and Communications, Atomic and Molecular Physics, and Optics and Hardware and Architecture, having authored 15 papers that have together received 380 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (12 papers), 3D IC and TSV technologies (7 papers), Electrostatic Discharge in Electronics (7 papers), Control Systems and Identification (3 papers), Electromagnetic Compatibility and Measurements (3 papers), Electronic Packaging and Soldering Technologies (2 papers), Electromagnetic Scattering and Analysis (1 paper) and VLSI and Analog Circuit Testing (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (366 citations), Hardware and Architecture (45 citations), Computational Mathematics (2 citations), Aerospace Engineering (65 citations) and Electronic, Optical and Magnetic Materials (22 citations). J.P. Libous has collaborated with scholars based in United States, South Korea and Canada. Frequent co-authors include Madhavan Swaminathan, István Novák, Joungho Kim, Bhyrav Mutnury, Daniel O’Connor, Jean Audet, Suna Choi, Lara B. Eisenberg, J. Morsey and A. Deutsch. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology Part B and Electrical Performance of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.