J.P. Libous
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
- VLSI and FPGA Design Techniques
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electronic Packaging and Soldering Technologies
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- VLSI and Analog Circuit Testing
Papers in
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- Electromagnetic Compatibility and Noise Suppression 12
- VLSI and FPGA Design Techniques 3
- Low-power high-performance VLSI design 2
- 3D IC and TSV technologies 2
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- VLSI and Analog Circuit Testing 2
- Co-authors
- Madhavan Swaminathan (8 shared papers)Joungho Kim (1 shared paper)István Novák (1 shared paper)Bhyrav Mutnury (3 shared papers)Jin‐Woo Choi (1 shared paper)Suna Choi (1 shared paper)Christopher W. Surovic (1 shared paper)Li Jun Jiang (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)Electrical Performance of Electronic Packaging (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (3 papers)IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP) (1 paper)
- Partner nations
- United StatesSouth KoreaCanada
In The Last Decade
J.P. Libous
16 papers receiving 379 citations
Peers
Comparison fields: 5 of 21
- Electrical and Electronic Engineering 386
- Hardware and Architecture 24
- Biomedical Engineering 80
- Computational Mathematics 1
- Computer Graphics and Computer-Aided Design 3
Countries citing papers authored by J.P. Libous
This map shows the geographic impact of J.P. Libous's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.P. Libous with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.P. Libous more than expected).
Fields of papers citing papers by J.P. Libous
This network shows the impact of papers produced by J.P. Libous. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.P. Libous. The network helps show where J.P. Libous may publish in the future.
Co-authors
The 10 scholars most cited alongside J.P. Libous, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 210 | |
| 2 | 2006 | 67 | |
| 3 | 1997 | 37 | |
| 4 | 2002 | 23 | |
| 5 | 2003 | 18 | |
| 6 | 2002 | 8 | |
| 7 | 2003 | 7 | |
| 8 | 2002 | 6 | |
| 9 | 2002 | 6 | |
| 10 | 2002 | 6 | |
| 11 | 2004 | 6 | |
| 12 | 2004 | 6 | |
| 13 | 2003 | 3 | |
| 14 | 2002 | 2 | |
| 15 | 2007 | 2 | |
| 16 | 2002 | 1 |
About J.P. Libous
J.P. Libous is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Biomedical Engineering, Control and Systems Engineering and Atomic and Molecular Physics, and Optics, having authored 16 papers that have together received 408 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (12 papers), Analog and Mixed-Signal Circuit Design (5 papers), VLSI and FPGA Design Techniques (3 papers), VLSI and Analog Circuit Testing (2 papers), Low-power high-performance VLSI design (2 papers), 3D IC and TSV technologies (2 papers), Control Systems and Identification (1 paper) and Neural Networks and Applications (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (386 citations), Hardware and Architecture (24 citations), Biomedical Engineering (80 citations), Computational Mathematics (1 citation) and Computer Graphics and Computer-Aided Design (3 citations). J.P. Libous has collaborated with scholars based in United States, South Korea and Canada. Frequent co-authors include Madhavan Swaminathan, Joungho Kim, István Novák, Bhyrav Mutnury, Jin‐Woo Choi, Suna Choi, Christopher W. Surovic, Li Jun Jiang, J. Morsey and Alina Deutsch. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Electrical Performance of Electronic Packaging, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.