S. Dalmia
Impact in
-
- Radio Frequency Integrated Circuit Design
- Microwave Engineering and Waveguides
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Semiconductor Lasers and Optical Devices
- Electronic Packaging and Soldering Technologies
- Advanced Power Amplifier Design
-
- Advanced Antenna and Metasurface Technologies
Papers in
-
- Microwave Engineering and Waveguides 31
- Radio Frequency Integrated Circuit Design 29
- Electromagnetic Compatibility and Noise Suppression 15
- Semiconductor Lasers and Optical Devices 8
- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 6
- Advanced Power Amplifier Design 4
- Co-authors
- Madhavan Swaminathan (32 shared papers)G. Edward White (29 shared papers)V. Sundaram (16 shared papers)V. Govind (12 shared papers)Rao Tummala (13 shared papers)Farrokh Ayazi (5 shared papers)Bhyrav Mutnury (2 shared papers)Trang Thai (2 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)Journal of Electroceramics (1 paper)International Journal of RF and Microwave Computer-Aided Engineering (1 paper)IEEE Wireless Communications (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)
- Partner nations
- United StatesJapanIsrael
In The Last Decade
S. Dalmia
47 papers receiving 346 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 344
- Aerospace Engineering 71
- Electronic, Optical and Magnetic Materials 20
- Polymers and Plastics 14
- Biomedical Engineering 39
Countries citing papers authored by S. Dalmia
This map shows the geographic impact of S. Dalmia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Dalmia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Dalmia more than expected).
Fields of papers citing papers by S. Dalmia
This network shows the impact of papers produced by S. Dalmia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Dalmia. The network helps show where S. Dalmia may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Dalmia, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 48 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 31 | |
| 2 | 2003 | 23 | |
| 3 | 2005 | 23 | |
| 4 | 2004 | 22 | |
| 5 | 2002 | 18 | |
| 6 | 2003 | 18 | |
| 7 | 2019 | 17 | |
| 8 | 2004 | 16 | |
| 9 | 2003 | 16 | |
| 10 | 2004 | 15 | |
| 11 | 2003 | 13 | |
| 12 | 2006 | 12 | |
| 13 | 2003 | 11 | |
| 14 | 2007 | 10 | |
| 15 | 2004 | 9 | |
| 16 | 2004 | 9 | |
| 17 | 2004 | 8 | |
| 18 | 2005 | 8 | |
| 19 | 2002 | 7 | |
| 20 | 2002 | 7 |
About S. Dalmia
S. Dalmia is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Computer Networks and Communications, Biomedical Engineering and Polymers and Plastics, having authored 48 papers that have together received 369 indexed citations. Recurring topics across this work include Microwave Engineering and Waveguides (31 papers), Radio Frequency Integrated Circuit Design (29 papers), Electromagnetic Compatibility and Noise Suppression (15 papers), Semiconductor Lasers and Optical Devices (8 papers), 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers), Advanced Power Amplifier Design (4 papers) and Bluetooth and Wireless Communication Technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (344 citations), Aerospace Engineering (71 citations), Electronic, Optical and Magnetic Materials (20 citations), Polymers and Plastics (14 citations) and Biomedical Engineering (39 citations). S. Dalmia has collaborated with scholars based in United States, Japan and Israel. Frequent co-authors include Madhavan Swaminathan, G. Edward White, V. Sundaram, V. Govind, Rao Tummala, Farrokh Ayazi, Bhyrav Mutnury, Trang Thai, Fuhan Liu and Swapan K. Bhattacharya. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Journal of Electroceramics, International Journal of RF and Microwave Computer-Aided Engineering, IEEE Wireless Communications and IEEE Transactions on Microwave Theory and Techniques.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.