Sungjun Im
Impact in
- Hardware and Architecture top 10%
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- VLSI and FPGA Design Techniques
Papers in
-
- 3D IC and TSV technologies 3
- Silicon Carbide Semiconductor Technologies 2
- Electronic Packaging and Soldering Technologies 2
- Advancements in Semiconductor Devices and Circuit Design 2
- Semiconductor materials and devices 2
-
- Copper Interconnects and Reliability 3
- Co-authors
- Kaustav Banerjee (4 shared papers)Kenneth E. Goodson (4 shared papers)Jae-Mo Koo (2 shared papers)Linan Jiang (2 shared papers)Navin Srivastava (2 shared papers)Krishnarjun Banerjee (1 shared paper)Ravi Prasher (1 shared paper)Evelyn N. Wang (1 shared paper)
- Journals
- Journal of Heat Transfer (1 paper)
- Partner nations
- United StatesSouth Korea
In The Last Decade
Sungjun Im
7 papers receiving 358 citations
Peers
Comparison fields: 5 of 24
- Hardware and Architecture 39
- Electrical and Electronic Engineering 289
- Mechanical Engineering 147
- Automotive Engineering 24
- Computer Networks and Communications 36
Countries citing papers authored by Sungjun Im
This map shows the geographic impact of Sungjun Im's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungjun Im with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungjun Im more than expected).
Fields of papers citing papers by Sungjun Im
This network shows the impact of papers produced by Sungjun Im. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungjun Im. The network helps show where Sungjun Im may publish in the future.
Co-authors
The 13 scholars most cited alongside Sungjun Im, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 193 | |
| 2 | 2002 | 153 | |
| 3 | Interconnect Modeling and Analysis in the Nanometer Era: Cu and Beyond | 2005 | 12 |
| 4 | 2003 | 10 | |
| 5 | 2002 | 5 | |
| 6 | 2006 | 5 | |
| 7 | 2003 | 4 |
About Sungjun Im
Sungjun Im is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Materials Chemistry and Infectious Diseases, having authored 7 papers that have together received 382 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (3 papers), Copper Interconnects and Reliability (3 papers), Heat Transfer and Boiling Studies (2 papers), Heat Transfer and Optimization (2 papers), Silicon Carbide Semiconductor Technologies (2 papers), Electronic Packaging and Soldering Technologies (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers) and Semiconductor materials and devices (2 papers). The work is most often cited by research in Hardware and Architecture (39 citations), Electrical and Electronic Engineering (289 citations), Mechanical Engineering (147 citations), Automotive Engineering (24 citations) and Computer Networks and Communications (36 citations). Sungjun Im has collaborated with scholars based in United States and South Korea. Frequent co-authors include Kaustav Banerjee, Kenneth E. Goodson, Jae-Mo Koo, Linan Jiang, Navin Srivastava, Krishnarjun Banerjee, Ravi Prasher, Evelyn N. Wang, Thomas W. Kenny and Min Soo Kim. Their work appears in journals such as Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.