Kai Fu
Impact in
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- Diamond and Carbon-based Materials Research
- Graphene research and applications
- ZnO doping and properties
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- 3D IC and TSV technologies
- Semiconductor materials and devices
Papers in
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- 3D IC and TSV technologies 11
- Semiconductor materials and devices 7
- Electromagnetic Compatibility and Noise Suppression 6
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- ZnO doping and properties 7
- Diamond and Carbon-based Materials Research 4
- Co-authors
- Paul K. Chu (8 shared papers)Gaofeng Wang (12 shared papers)Wen‐Sheng Zhao (11 shared papers)X.B. Tian (3 shared papers)Da‐Wei Wang (5 shared papers)Jiajun Li (1 shared paper)Chunnian He (1 shared paper)Xiang Zhang (1 shared paper)
- Journals
- Surface and Coatings Technology (4 papers)Materials Science and Engineering A (3 papers)IEEE Transactions on Antennas and Propagation (2 papers)IEEE Access (2 papers)Journal of Applied Physics (2 papers)
- Partner nations
- ChinaHong KongUnited States
In The Last Decade
Kai Fu
50 papers receiving 660 citations
Peers
Comparison fields: 5 of 66
- Materials Chemistry 347
- Electrical and Electronic Engineering 282
- Mechanics of Materials 120
- Electronic, Optical and Magnetic Materials 87
- Mechanical Engineering 146
Countries citing papers authored by Kai Fu
This map shows the geographic impact of Kai Fu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Fu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Fu more than expected).
Fields of papers citing papers by Kai Fu
This network shows the impact of papers produced by Kai Fu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Fu. The network helps show where Kai Fu may publish in the future.
Co-authors
The 25 scholars most cited alongside Kai Fu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 54 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 107 | |
| 2 | 2017 | 89 | |
| 3 | 2022 | 37 | |
| 4 | 2024 | 35 | |
| 5 | 2021 | 33 | |
| 6 | 2018 | 33 | |
| 7 | 2018 | 32 | |
| 8 | 2013 | 22 | |
| 9 | 2019 | 21 | |
| 10 | 2020 | 21 | |
| 11 | 2004 | 20 | |
| 12 | 2013 | 17 | |
| 13 | 2024 | 16 | |
| 14 | 2004 | 15 | |
| 15 | 2002 | 14 | |
| 16 | 2020 | 13 | |
| 17 | 2003 | 13 | |
| 18 | 2020 | 11 | |
| 19 | 2018 | 11 | |
| 20 | 2019 | 10 |
About Kai Fu
Kai Fu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering, having authored 54 papers that have together received 673 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), ZnO doping and properties (7 papers), Ga2O3 and related materials (7 papers), Semiconductor materials and devices (7 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), GaN-based semiconductor devices and materials (5 papers), Diamond and Carbon-based Materials Research (4 papers) and Aluminum Alloys Composites Properties (4 papers). The work is most often cited by research in Materials Chemistry (347 citations), Electrical and Electronic Engineering (282 citations), Mechanics of Materials (120 citations), Electronic, Optical and Magnetic Materials (87 citations) and Mechanical Engineering (146 citations). Kai Fu has collaborated with scholars based in China, Hong Kong and United States. Frequent co-authors include Paul K. Chu, Gaofeng Wang, Wen‐Sheng Zhao, X.B. Tian, Da‐Wei Wang, Jiajun Li, Chunnian He, Xiang Zhang, Naiqin Zhao and Chunsheng Shi. Their work appears in journals such as Surface and Coatings Technology, Materials Science and Engineering A, IEEE Transactions on Antennas and Propagation, IEEE Access and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.