Patrick R. Justison
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Copper Interconnects and Reliability 29
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- Semiconductor materials and devices 29
- Electronic Packaging and Soldering Technologies 27
- Integrated Circuits and Semiconductor Failure Analysis 11
- 3D IC and TSV technologies 9
- Advancements in Semiconductor Devices and Circuit Design 3
- Electrostatic Discharge in Electronics 3
- Co-authors
- Paul S. Ho (13 shared papers)Volker A. Blaschke (4 shared papers)Ennis T. Ogawa (3 shared papers)Meike Hauschildt (8 shared papers)M. Gall (7 shared papers)Tian Shen (13 shared papers)Hisao Kawasaki (6 shared papers)Haojun Zhang (7 shared papers)
- Journals
- Applied Physics Letters (4 papers)Journal of Applied Physics (4 papers)IEEE Electron Device Letters (2 papers)IEEE Transactions on Electron Devices (2 papers)MRS Proceedings (3 papers)
- Partner nations
- United StatesGermanyCanada
In The Last Decade
Patrick R. Justison
42 papers receiving 508 citations
Peers
Comparison fields: 5 of 37
- Electronic, Optical and Magnetic Materials 326
- Electrical and Electronic Engineering 509
- Hardware and Architecture 18
- Mechanics of Materials 49
- Automotive Engineering 11
Countries citing papers authored by Patrick R. Justison
This map shows the geographic impact of Patrick R. Justison's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick R. Justison with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick R. Justison more than expected).
Fields of papers citing papers by Patrick R. Justison
This network shows the impact of papers produced by Patrick R. Justison. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick R. Justison. The network helps show where Patrick R. Justison may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick R. Justison, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 46 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 74 | |
| 2 | 2001 | 55 | |
| 3 | 2017 | 46 | |
| 4 | 2002 | 39 | |
| 5 | 2007 | 35 | |
| 6 | 2017 | 30 | |
| 7 | 2008 | 27 | |
| 8 | 2018 | 20 | |
| 9 | 2011 | 19 | |
| 10 | 2004 | 17 | |
| 11 | 2014 | 15 | |
| 12 | 2000 | 15 | |
| 13 | 2006 | 15 | |
| 14 | 2014 | 12 | |
| 15 | 2016 | 12 | |
| 16 | 2018 | 8 | |
| 17 | 2018 | 8 | |
| 18 | 2018 | 8 | |
| 19 | 2006 | 7 | |
| 20 | 2016 | 7 |
About Patrick R. Justison
Patrick R. Justison is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry and Surfaces, Coatings and Films, having authored 46 papers that have together received 539 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (29 papers), Semiconductor materials and devices (29 papers), Electronic Packaging and Soldering Technologies (27 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers), 3D IC and TSV technologies (9 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Electrostatic Discharge in Electronics (3 papers) and Metal and Thin Film Mechanics (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (326 citations), Electrical and Electronic Engineering (509 citations), Hardware and Architecture (18 citations), Mechanics of Materials (49 citations) and Automotive Engineering (11 citations). Patrick R. Justison has collaborated with scholars based in United States, Germany and Canada. Frequent co-authors include Paul S. Ho, Volker A. Blaschke, Ennis T. Ogawa, Meike Hauschildt, M. Gall, Tian Shen, Hisao Kawasaki, Haojun Zhang, Robert Havemann and Kong Boon Yeap. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, IEEE Electron Device Letters, IEEE Transactions on Electron Devices and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.