Robert Havemann
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Low-power high-performance VLSI design
Papers in
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- Semiconductor materials and devices 39
- Advancements in Semiconductor Devices and Circuit Design 10
- Integrated Circuits and Semiconductor Failure Analysis 6
- 3D IC and TSV technologies 6
- Electronic Packaging and Soldering Technologies 6
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- Copper Interconnects and Reliability 31
- Co-authors
- J.A. Hutchby (1 shared paper)Shin-Puu Jeng (5 shared papers)Mi-Chang Chang (4 shared papers)V. Blaschke (5 shared papers)Paul S. Ho (5 shared papers)J. D. Luttmer (9 shared papers)Patrick Justison (3 shared papers)R. Harris (1 shared paper)
- Journals
- Thin Solid Films (3 papers)Proceedings of the IEEE (2 papers)Journal of Electronic Materials (2 papers)IEEE Journal of Solid-State Circuits (1 paper)Applied Physics Letters (1 paper)
- Partner nations
- United StatesNetherlandsTaiwan
In The Last Decade
Robert Havemann
54 papers receiving 660 citations
Peers
Comparison fields: 5 of 46
- Electronic, Optical and Magnetic Materials 345
- Electrical and Electronic Engineering 588
- Hardware and Architecture 30
- Mechanics of Materials 103
- Atomic and Molecular Physics, and Optics 104
Countries citing papers authored by Robert Havemann
This map shows the geographic impact of Robert Havemann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert Havemann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert Havemann more than expected).
Fields of papers citing papers by Robert Havemann
This network shows the impact of papers produced by Robert Havemann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert Havemann. The network helps show where Robert Havemann may publish in the future.
Co-authors
The 25 scholars most cited alongside Robert Havemann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 57 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 231 | |
| 2 | 2001 | 50 | |
| 3 | 1998 | 44 | |
| 4 | 1994 | 35 | |
| 5 | 2002 | 33 | |
| 6 | 1987 | 26 | |
| 7 | 1978 | 20 | |
| 8 | 2001 | 19 | |
| 9 | 2002 | 18 | |
| 10 | 1998 | 16 | |
| 11 | 1994 | 16 | |
| 12 | 1988 | 14 | |
| 13 | 2000 | 13 | |
| 14 | 1998 | 13 | |
| 15 | 2002 | 11 | |
| 16 | 1995 | 10 | |
| 17 | 2006 | 9 | |
| 18 | 1978 | 8 | |
| 19 | 1996 | 8 | |
| 20 | 1996 | 8 |
About Robert Havemann
Robert Havemann is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Surfaces, Coatings and Films, having authored 57 papers that have together received 710 indexed citations. Recurring topics across this work include Semiconductor materials and devices (39 papers), Copper Interconnects and Reliability (31 papers), Semiconductor materials and interfaces (12 papers), Advancements in Semiconductor Devices and Circuit Design (10 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (6 papers) and Metal and Thin Film Mechanics (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (345 citations), Electrical and Electronic Engineering (588 citations), Hardware and Architecture (30 citations), Mechanics of Materials (103 citations) and Atomic and Molecular Physics, and Optics (104 citations). Robert Havemann has collaborated with scholars based in United States, Netherlands and Taiwan. Frequent co-authors include J.A. Hutchby, Shin-Puu Jeng, Mi-Chang Chang, V. Blaschke, Paul S. Ho, J. D. Luttmer, Patrick Justison, R. Harris, C.A. Hamilton and Ennis T. Ogawa. Their work appears in journals such as Thin Solid Films, Proceedings of the IEEE, Journal of Electronic Materials, IEEE Journal of Solid-State Circuits and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.