Ki‐Don Lee
Impact in
- Aerospace Engineering top 2%
- Turbomachinery Performance and Optimization
- Computational Mechanics top 2%
- Fluid Dynamics and Turbulent Flows
- Combustion and flame dynamics
Papers in
-
- Heat Transfer Mechanisms 22
- Heat Transfer and Optimization 9
-
- Semiconductor materials and devices 18
- Electronic Packaging and Soldering Technologies 10
- Advancements in Semiconductor Devices and Circuit Design 6
- Co-authors
- Kwang‐Yong Kim (24 shared papers)Paul S. Ho (5 shared papers)E.T. Ogawa (2 shared papers)V. Blaschke (3 shared papers)Sun-Min Kim (4 shared papers)Abdus Samad (2 shared papers)Afzal Husain (2 shared papers)Young-Joon Park (4 shared papers)
- Journals
- Numerical Heat Transfer Part A Applications (4 papers)Heat and Mass Transfer (3 papers)International Journal of Heat and Mass Transfer (2 papers)International Journal of Thermal Sciences (1 paper)Journal of Heat Transfer (1 paper)
- Partner nations
- South KoreaUnited States
In The Last Decade
Ki‐Don Lee
38 papers receiving 1.0k citations
Peers
Comparison fields: 5 of 46
- Aerospace Engineering 556
- Computational Mechanics 395
- Mechanical Engineering 637
- Electronic, Optical and Magnetic Materials 251
- Electrical and Electronic Engineering 305
Countries citing papers authored by Ki‐Don Lee
This map shows the geographic impact of Ki‐Don Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ki‐Don Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ki‐Don Lee more than expected).
Fields of papers citing papers by Ki‐Don Lee
This network shows the impact of papers produced by Ki‐Don Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ki‐Don Lee. The network helps show where Ki‐Don Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Ki‐Don Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 196 | |
| 2 | 2010 | 145 | |
| 3 | 2010 | 91 | |
| 4 | 2013 | 49 | |
| 5 | 2013 | 48 | |
| 6 | 2009 | 46 | |
| 7 | 2012 | 44 | |
| 8 | 2012 | 34 | |
| 9 | 2012 | 33 | |
| 10 | 2011 | 32 | |
| 11 | 2008 | 32 | |
| 12 | 2013 | 26 | |
| 13 | 2010 | 25 | |
| 14 | 2013 | 25 | |
| 15 | 2010 | 23 | |
| 16 | 2010 | 19 | |
| 17 | 2012 | 19 | |
| 18 | 2012 | 18 | |
| 19 | 2017 | 14 | |
| 20 | 2000 | 13 |
About Ki‐Don Lee
Ki‐Don Lee is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Aerospace Engineering, Computational Mechanics and Electronic, Optical and Magnetic Materials, having authored 43 papers that have together received 1.0k indexed citations. Recurring topics across this work include Heat Transfer Mechanisms (22 papers), Semiconductor materials and devices (18 papers), Turbomachinery Performance and Optimization (16 papers), Fluid Dynamics and Turbulent Flows (14 papers), Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (10 papers), Heat Transfer and Optimization (9 papers) and Advancements in Semiconductor Devices and Circuit Design (6 papers). The work is most often cited by research in Aerospace Engineering (556 citations), Computational Mechanics (395 citations), Mechanical Engineering (637 citations), Electronic, Optical and Magnetic Materials (251 citations) and Electrical and Electronic Engineering (305 citations). Ki‐Don Lee has collaborated with scholars based in South Korea and United States. Frequent co-authors include Kwang‐Yong Kim, Paul S. Ho, E.T. Ogawa, V. Blaschke, Sun-Min Kim, Abdus Samad, Afzal Husain, Young-Joon Park, Min-Jung Park and W. R. Hunter. Their work appears in journals such as Numerical Heat Transfer Part A Applications, Heat and Mass Transfer, International Journal of Heat and Mass Transfer, International Journal of Thermal Sciences and Journal of Heat Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.