C. C. Goldsmith
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 24
- 3D IC and TSV technologies 16
-
- Advanced Welding Techniques Analysis 5
- Co-authors
- Da‐Yuan Shih (12 shared papers)Donald W. Henderson (5 shared papers)Paul Lauro (9 shared papers)Minhua Lu (8 shared papers)Timothy Gosselin (5 shared papers)Karl J. Puttlitz (5 shared papers)Sung K. Kang (5 shared papers)I. C. Noyan (6 shared papers)
- Journals
- Applied Physics Letters (4 papers)Journal of Applied Physics (3 papers)Journal of materials research/Pratt's guide to venture capital sources (3 papers)Thin Solid Films (1 paper)MATERIALS TRANSACTIONS (1 paper)
- Partner nations
- United StatesSouth KoreaCanada
In The Last Decade
C. C. Goldsmith
35 papers receiving 984 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 948
- Mechanical Engineering 525
- General Materials Science 38
- Electronic, Optical and Magnetic Materials 225
- Aerospace Engineering 198
Countries citing papers authored by C. C. Goldsmith
This map shows the geographic impact of C. C. Goldsmith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. C. Goldsmith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. C. Goldsmith more than expected).
Fields of papers citing papers by C. C. Goldsmith
This network shows the impact of papers produced by C. C. Goldsmith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. C. Goldsmith. The network helps show where C. C. Goldsmith may publish in the future.
Co-authors
The 25 scholars most cited alongside C. C. Goldsmith, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 203 | |
| 2 | 2002 | 170 | |
| 3 | 2004 | 170 | |
| 4 | 2002 | 69 | |
| 5 | 1997 | 46 | |
| 6 | 1983 | 42 | |
| 7 | 2004 | 38 | |
| 8 | 2004 | 37 | |
| 9 | 2004 | 36 | |
| 10 | 2008 | 24 | |
| 11 | 2004 | 22 | |
| 12 | 2009 | 22 | |
| 13 | 2009 | 21 | |
| 14 | 2004 | 15 | |
| 15 | 1973 | 14 | |
| 16 | 2009 | 14 | |
| 17 | 1990 | 10 | |
| 18 | 2003 | 10 | |
| 19 | 2004 | 10 | |
| 20 | 2006 | 9 |
About C. C. Goldsmith
C. C. Goldsmith is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Materials Chemistry, having authored 36 papers that have together received 1.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (16 papers), Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (8 papers), Advanced Welding Techniques Analysis (5 papers), Aluminum Alloy Microstructure Properties (4 papers), Advanced ceramic materials synthesis (3 papers) and Mechanical Behavior of Composites (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (948 citations), Mechanical Engineering (525 citations), General Materials Science (38 citations), Electronic, Optical and Magnetic Materials (225 citations) and Aerospace Engineering (198 citations). C. C. Goldsmith has collaborated with scholars based in United States, South Korea and Canada. Frequent co-authors include Da‐Yuan Shih, Donald W. Henderson, Paul Lauro, Minhua Lu, Timothy Gosselin, Karl J. Puttlitz, Sung K. Kang, I. C. Noyan, Amit Sarkhel and T. Shaw. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources, Thin Solid Films and MATERIALS TRANSACTIONS.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.