David M. Shaddock
Impact in
-
- Electronic Packaging and Soldering Technologies
- Nanomaterials and Printing Technologies
- Silicon Carbide Semiconductor Technologies
- Electrical and Thermal Properties of Materials
- Advanced MEMS and NEMS Technologies
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 37
- Nanomaterials and Printing Technologies 6
- Silicon Carbide Semiconductor Technologies 6
- Electrical and Thermal Properties of Materials 4
- 3D IC and TSV technologies 4
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- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- Junghyun Cho (12 shared papers)Liang Yin (17 shared papers)Aaron J. Knobloch (5 shared papers)Shubhra Bansal (4 shared papers)Wayne R. Johnson (9 shared papers)Mohammed Alhendi (11 shared papers)Nancy C. Stoffel (7 shared papers)Mark D. Poliks (12 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Advanced Engineering Materials (2 papers)Journal of Electronic Packaging (1 paper)Materials Science and Engineering A (1 paper)Additive manufacturing (1 paper)
- Partner nations
- United States
In The Last Decade
David M. Shaddock
45 papers receiving 349 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 270
- Automotive Engineering 29
- General Materials Science 5
- Materials Chemistry 41
- Mechanical Engineering 33
Countries citing papers authored by David M. Shaddock
This map shows the geographic impact of David M. Shaddock's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David M. Shaddock with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David M. Shaddock more than expected).
Fields of papers citing papers by David M. Shaddock
This network shows the impact of papers produced by David M. Shaddock. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David M. Shaddock. The network helps show where David M. Shaddock may publish in the future.
Co-authors
The 25 scholars most cited alongside David M. Shaddock, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 52 | |
| 2 | 2009 | 35 | |
| 3 | 2005 | 20 | |
| 4 | 2003 | 19 | |
| 5 | 2018 | 17 | |
| 6 | 2010 | 16 | |
| 7 | 2011 | 16 | |
| 8 | 2010 | 14 | |
| 9 | 2022 | 14 | |
| 10 | 2017 | 11 | |
| 11 | 2012 | 10 | |
| 12 | 2014 | 10 | |
| 13 | 2012 | 8 | |
| 14 | 2014 | 8 | |
| 15 | 2023 | 8 | |
| 16 | 2003 | 7 | |
| 17 | 2012 | 7 | |
| 18 | 2015 | 7 | |
| 19 | 2018 | 7 | |
| 20 | 1998 | 6 |
About David M. Shaddock
David M. Shaddock is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Safety, Risk, Reliability and Quality, Materials Chemistry and Condensed Matter Physics, having authored 52 papers that have together received 358 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (37 papers), Nanomaterials and Printing Technologies (6 papers), Silicon Carbide Semiconductor Technologies (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Electrical and Thermal Properties of Materials (4 papers), 3D IC and TSV technologies (4 papers), Thermal properties of materials (2 papers) and Reliability and Maintenance Optimization (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (270 citations), Automotive Engineering (29 citations), General Materials Science (5 citations), Materials Chemistry (41 citations) and Mechanical Engineering (33 citations). David M. Shaddock has collaborated with scholars based in United States. Frequent co-authors include Junghyun Cho, Liang Yin, Aaron J. Knobloch, Shubhra Bansal, Wayne R. Johnson, Mohammed Alhendi, Nancy C. Stoffel, Mark D. Poliks, Cathleen Hoel and Peter Børgesen. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Advanced Engineering Materials, Journal of Electronic Packaging, Materials Science and Engineering A and Additive manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.