John U. Knickerbocker
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
Papers in
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- 3D IC and TSV technologies 59
- Electronic Packaging and Soldering Technologies 16
- Semiconductor Lasers and Optical Devices 12
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- Parallel Computing and Optimization Techniques 2
- Co-authors
- Cornelia K. Tsang (44 shared papers)Paul S. Andry (37 shared papers)Robert J. Polastre (25 shared papers)Chirag S. Patel (21 shared papers)S. L. Wright (21 shared papers)R. Horton (17 shared papers)Bucknell C. Webb (21 shared papers)B. Dang (18 shared papers)
- Journals
- IBM Journal of Research and Development (10 papers)IEEE Journal of Solid-State Circuits (2 papers)Journal of the American Ceramic Society (1 paper)IEEE Access (1 paper)IEEE Electron Device Letters (1 paper)
- Partner nations
- United StatesJapanCanada
In The Last Decade
John U. Knickerbocker
89 papers receiving 2.8k citations
John U. Knickerbocker's Hit Papers
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 2.6k
- Hardware and Architecture 134
- Computer Networks and Communications 102
- Mechanical Engineering 141
- Electronic, Optical and Magnetic Materials 50
Countries citing papers authored by John U. Knickerbocker
This map shows the geographic impact of John U. Knickerbocker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John U. Knickerbocker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John U. Knickerbocker more than expected).
Fields of papers citing papers by John U. Knickerbocker
This network shows the impact of papers produced by John U. Knickerbocker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John U. Knickerbocker. The network helps show where John U. Knickerbocker may publish in the future.
Co-authors
The 25 scholars most cited alongside John U. Knickerbocker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 91 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 426 |
| 2 | 2015 | 247 | |
| 3 | 2005 | 205 | |
| 4 | 2008 | 194 | |
| 5 | 2006 | 159 | |
| 6 | 2008 | 135 | |
| 7 | 2012 | 86 | |
| 8 | 2011 | 84 | |
| 9 | 2006 | 76 | |
| 10 | 2007 | 70 | |
| 11 | 2010 | 57 | |
| 12 | 2008 | 56 | |
| 13 | 2012 | 53 | |
| 14 | 2018 | 48 | |
| 15 | 2008 | 42 | |
| 16 | 2011 | 42 | |
| 17 | 2010 | 41 | |
| 18 | 2002 | 39 | |
| 19 | 2006 | 36 | |
| 20 | 2005 | 35 |
About John U. Knickerbocker
John U. Knickerbocker is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Biomedical Engineering and Human-Computer Interaction, having authored 91 papers that have together received 3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (59 papers), Electronic Packaging and Soldering Technologies (16 papers), Semiconductor Lasers and Optical Devices (12 papers), Advanced Sensor and Energy Harvesting Materials (6 papers), Interconnection Networks and Systems (5 papers), Heat Transfer and Boiling Studies (4 papers), Parallel Computing and Optimization Techniques (2 papers) and Hand Gesture Recognition Systems (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.6k citations), Hardware and Architecture (134 citations), Computer Networks and Communications (102 citations), Mechanical Engineering (141 citations) and Electronic, Optical and Magnetic Materials (50 citations). John U. Knickerbocker has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Cornelia K. Tsang, Paul S. Andry, Robert J. Polastre, Chirag S. Patel, S. L. Wright, R. Horton, Bucknell C. Webb, B. Dang, Edmund J. Sprogis and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Journal of Solid-State Circuits, Journal of the American Ceramic Society, IEEE Access and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.