Eric Kuah
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 6
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- Copper Interconnects and Reliability 3
- Co-authors
- Kai Wu (6 shared papers)Nelson Fan (5 shared papers)K. H. Tan (5 shared papers)John H. Lau (5 shared papers)Margie Li (4 shared papers)Rozalia Beica (4 shared papers)Sze Pei Lim (4 shared papers)Xi Cao (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IMAPSource Proceedings (1 paper)
- Partner nations
- United StatesChinaUnited Kingdom
In The Last Decade
Eric Kuah
9 papers receiving 82 citations
Peers
Comparison fields: 5 of 21
- Electrical and Electronic Engineering 107
- Hardware and Architecture 6
- Electronic, Optical and Magnetic Materials 15
- Industrial and Manufacturing Engineering 8
- Automotive Engineering 9
Countries citing papers authored by Eric Kuah
This map shows the geographic impact of Eric Kuah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Kuah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Kuah more than expected).
Fields of papers citing papers by Eric Kuah
This network shows the impact of papers produced by Eric Kuah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Kuah. The network helps show where Eric Kuah may publish in the future.
Co-authors
The 25 scholars most cited alongside Eric Kuah, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 40 | |
| 2 | 2017 | 32 | |
| 3 | 2017 | 16 | |
| 4 | 2017 | 10 | |
| 5 | 2015 | 4 | |
| 6 | 2018 | 4 | |
| 7 | 2016 | 4 | |
| 8 | 2016 | 2 | |
| 9 | 2016 | 1 |
About Eric Kuah
Eric Kuah is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Computer Vision and Pattern Recognition, Mechanics of Materials and Computer Networks and Communications, having authored 9 papers that have together received 113 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers), Copper Interconnects and Reliability (3 papers), Material Properties and Processing (2 papers), Music Technology and Sound Studies (2 papers), Injection Molding Process and Properties (1 paper), Nanofabrication and Lithography Techniques (1 paper) and Manufacturing Process and Optimization (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (107 citations), Hardware and Architecture (6 citations), Electronic, Optical and Magnetic Materials (15 citations), Industrial and Manufacturing Engineering (8 citations) and Automotive Engineering (9 citations). Eric Kuah has collaborated with scholars based in United States, China and United Kingdom. Frequent co-authors include Kai Wu, Nelson Fan, K. H. Tan, John H. Lau, Margie Li, Rozalia Beica, Sze Pei Lim, Xi Cao, Cheng-Ta Ko and Ming Li. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.