Eric Kuah
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Photolithography Techniques
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 6
- Electronic Packaging and Soldering Technologies 6
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- Copper Interconnects and Reliability 3
- Co-authors
- Margie Li (4 shared papers)John H. Lau (5 shared papers)K. H. Tan (5 shared papers)Nelson Fan (5 shared papers)Kai Wu (6 shared papers)Sze Pei Lim (4 shared papers)Xi Cao (4 shared papers)Rozalia Beica (4 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IMAPSource Proceedings (1 paper)
- Partner nations
- United StatesChinaUnited Kingdom
In The Last Decade
Eric Kuah
8 papers receiving 76 citations
Peers
Comparison fields: 5 of 20
- Electrical and Electronic Engineering 89
- Electronic, Optical and Magnetic Materials 15
- Industrial and Manufacturing Engineering 6
- Biomedical Engineering 20
- Mechanics of Materials 11
Countries citing papers authored by Eric Kuah
This map shows the geographic impact of Eric Kuah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Kuah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Kuah more than expected).
Fields of papers citing papers by Eric Kuah
This network shows the impact of papers produced by Eric Kuah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Kuah. The network helps show where Eric Kuah may publish in the future.
Co-authors
The 25 scholars most cited alongside Eric Kuah, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 40 | |
| 2 | 2017 | 27 | |
| 3 | 2017 | 11 | |
| 4 | 2017 | 5 | |
| 5 | 2018 | 3 | |
| 6 | 2015 | 3 | |
| 7 | 2016 | 3 | |
| 8 | 2016 | 1 |
About Eric Kuah
Eric Kuah is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Computer Networks and Communications, Automotive Engineering and Computer Vision and Pattern Recognition, having authored 8 papers that have together received 93 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (3 papers), Additive Manufacturing and 3D Printing Technologies (1 paper), Advanced Data Storage Technologies (1 paper), Music Technology and Sound Studies (1 paper), Nanofabrication and Lithography Techniques (1 paper) and Manufacturing Process and Optimization (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (89 citations), Electronic, Optical and Magnetic Materials (15 citations), Industrial and Manufacturing Engineering (6 citations), Biomedical Engineering (20 citations) and Mechanics of Materials (11 citations). Eric Kuah has collaborated with scholars based in United States, China and United Kingdom. Frequent co-authors include Margie Li, John H. Lau, K. H. Tan, Nelson Fan, Kai Wu, Sze Pei Lim, Xi Cao, Rozalia Beica, Cheng-Ta Ko and Iris Xu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.