T. Sullivan
Impact in
- Geophysics top 10%
- earthquake and tectonic studies
- Seismic Waves and Analysis
- Civil and Structural Engineering top 10%
- Seismic Performance and Analysis
- Structural Health Monitoring Techniques
- Geotechnical Engineering and Underground Structures
- Structural Response to Dynamic Loads
Papers in
-
- Electronic Packaging and Soldering Technologies 5
- Semiconductor materials and devices 4
-
- Copper Interconnects and Reliability 5
- Co-authors
- Norman Abrahamson (1 shared paper)James Casey (1 shared paper)J. C. Stepp (1 shared paper)Ivan G. Wong (1 shared paper)Robert Youngs (1 shared paper)Kevin J. Coppersmith (1 shared paper)J.B. Savy (1 shared paper)Gabriel R. Toro (1 shared paper)
- Journals
- IEEE Microwave and Wireless Components Letters (1 paper)International Journal of Plasticity (1 paper)Earthquake Spectra (1 paper)Thin Solid Films (1 paper)AIP conference proceedings (1 paper)
- Partner nations
- United StatesGermanyCanada
In The Last Decade
T. Sullivan
11 papers receiving 190 citations
Peers
Comparison fields: 5 of 33
- Geophysics 84
- Civil and Structural Engineering 112
- Statistics, Probability and Uncertainty 15
- Electrical and Electronic Engineering 52
- Mechanics of Materials 21
Countries citing papers authored by T. Sullivan
This map shows the geographic impact of T. Sullivan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sullivan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sullivan more than expected).
Fields of papers citing papers by T. Sullivan
This network shows the impact of papers produced by T. Sullivan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sullivan. The network helps show where T. Sullivan may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Sullivan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 129 | |
| 2 | 2006 | 32 | |
| 3 | 1985 | 24 | |
| 4 | 2006 | 5 | |
| 5 | 2001 | 5 | |
| 6 | 2003 | 5 | |
| 7 | 1996 | 4 | |
| 8 | 2007 | 2 | |
| 9 | 2003 | 1 | |
| 10 | 2006 | 1 | |
| 11 | Waste package reliability | 1986 | 1 |
| 12 | 1991 | 0 |
About T. Sullivan
T. Sullivan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Civil and Structural Engineering, Materials Chemistry and Industrial and Manufacturing Engineering, having authored 12 papers that have together received 209 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (5 papers), Semiconductor materials and devices (4 papers), Recycling and Waste Management Techniques (1 paper), Metal and Thin Film Mechanics (1 paper), Geotechnical Engineering and Underground Structures (1 paper), Structural Response to Dynamic Loads (1 paper) and VLSI and Analog Circuit Testing (1 paper). The work is most often cited by research in Geophysics (84 citations), Civil and Structural Engineering (112 citations), Statistics, Probability and Uncertainty (15 citations), Electrical and Electronic Engineering (52 citations) and Mechanics of Materials (21 citations). T. Sullivan has collaborated with scholars based in United States, Germany and Canada. Frequent co-authors include Norman Abrahamson, James Casey, J. C. Stepp, Ivan G. Wong, Robert Youngs, Kevin J. Coppersmith, J.B. Savy, Gabriel R. Toro, Richard C. Quittmeyer and John W. Whitney. Their work appears in journals such as IEEE Microwave and Wireless Components Letters, International Journal of Plasticity, Earthquake Spectra, Thin Solid Films and AIP conference proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.